Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJT A2012WVA-3P A2012WVA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJT A2012WVA-3P
- Type
- CJT
- Minimum package
- 1000 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJT
- Electronic Component
- A2012WVA-3P
- Electronic Component
- 1
- Package
- Through-hole, P=2mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0.206g
- Electronic Component
- 2mm
- PIN
- 3P
- Electronic Component
- 1
- Electronic Component
- BM0265448535
- Electronic Component
- PA66
- Electronic Component
- Through-hole
- Operating Temperature
- 40℃~+105℃
- Pin
- 1x3P
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
A2012WVA-3P 产品概述
一、产品简介
A2012WVA-3P 为 CJT（长江连接器）出品的一款线对板直插式插针座，排数 1 排、每排 3 PIN，间距 P=2.00mm，适用于紧凑型电路板的电源或信号连接。产品采用传统插件（直插）安装方式，便于波峰焊或手工焊接，适配常见连接线端子、端子排或对接插头使用。
二、主要参数
- 插针结构：1x3P（3 PIN）
- 间距（P）：2.00 mm
- 安装方式：直插（Through-hole）
- 额定电流：3 A（每针）
- 额定电压：250 V
- 工作温度范围：-40 ℃ ～ +105 ℃
三、结构与材料
- 触头材质：黄铜，保证良好导电性与机械强度
- 触头镀层：锡镀，兼顾焊接性与抗氧化能力
- 塑料材质：PA66，阻燃等级 UL94 V-0，适合对阻燃有要求的产品设计
该结构在体积与可靠性之间取得平衡，适合小型电源或信号连接场合。
四、典型应用场景
- 消费电子产品内板对板或线对板连接
- 小型电源模块、控制板、传感器模块的外供电或信号引出
- 家用电器、安防设备、照明驱动及工业控制中低功率连接点
- 原型开发与小批量生产的电路连线需求
五、安装与选型建议
- 推荐按 PCB 上 2.00 mm 间距开孔与焊盘布局，确保机械强度与焊接可靠性。
- 当使用较大电流或长时间工作时，注意导线截面与焊点质量，避免过热。
- 如需更高防护或密封性，可配合外壳、固定支撑或选用配套插头使用。
- 选择时确认板厚与插针长度匹配，保证插针垂直度与焊接余量。
六、注意事项与维护
- 建议在额定电流与环境温度范围内使用，避免超载导致接触点过热。
- 焊接时遵循 PA66 与锡镀触点的工艺要求，避免长时间高温集中加热。
- 存放与使用环境应避免腐蚀性气体和强酸强碱，以延长触点寿命。
A2012WVA-3P 以其紧凑的 2 mm 间距设计、可靠的材料组合及良好的阻燃性能，适合对体积和可靠性有要求的中低功率连接场合。如需进一步的二维尺寸图、PCB 封装建议或机械耐久性数据，可联系厂商索取详细资料与样品验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
