WMSIC Electronic Components

CJT A1257WV-S-4P-LCP A1257WV

ModelA1257WV-S-4P-LCP
PackageSMD,P=1.25mm
BrandCJT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJT A1257WV-S-4P-LCP
Type
SMD, P=1.25MM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJT
Electronic Component
A1257WV-S-4P-LCP
Electronic Component
1
Package
SMD,P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.512g
Electronic Component
1.25mm
PIN
4P
Electronic Component
1
Electronic Component
GH
Electronic Component
BM0264909222
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A1257WV-S-4P-LCP线对板针座产品概述

A1257WV-S-4P-LCP是长江连接器(CJT)推出的GH系列单排线对板针座,专为小型化、高密度电子设备的信号/电源传输设计,兼顾可靠性与工艺适配性,可满足多场景的连接需求。

一、产品基本定位与核心规格框架

该针座属于1x4P单排结构,引脚间距1.25mm,采用表面贴装立贴(SMD) 安装方式,总PIN数4P,兼容GH系列线端连接器,可实现稳定的线对板连接。其定位为中低功率(≤1A/PIN)、宽温环境(-40℃~+105℃)下的小型电子设备连接组件,适配自动化SMT生产流程。

二、电气与机械性能参数

2.1 电气性能

  • 额定电流:1A(单引脚持续工作电流,满足常规信号/小功率电源传输);
  • 额定电压:50V AC/DC(工作电压上限,适配低压电子系统);
  • 工作温度范围:-40℃至+105℃(覆盖工业级低温与消费电子高温场景);
  • 接触电阻:≤20mΩ(出厂标准,确保信号传输低损耗、无干扰)。

2.2 机械性能

  • 引脚间距:1.25mm(小型化高密度设计,较2.54mm常规间距节省约50%PCB空间);
  • 安装方式:立贴SMD(无需钻孔,适配SMT自动化生产,提升装配效率);
  • 结构规格:1排×4P(单排紧凑结构,减少占用空间);
  • 插拔力:1.5~3N(单PIN插拔力范围,兼顾连接牢固性与操作便捷性)。

三、材料与可靠性设计特性

3.1 触头系统

  • 触头材质:磷铜(兼具良好导电性、弹性与耐腐蚀性,长期使用无松动、无接触不良);
  • 触头镀层:锡(提升可焊性,抗氧化能力强,适配常规SMT焊接工艺,降低虚焊风险)。

3.2 塑料主体

  • 材质:液晶聚合物(LCP);
  • 核心优势:① 高温稳定性优异,可承受SMT焊接高温(≤260℃/10秒),避免塑料变形;② 尺寸精度高,引脚间距一致性达±0.05mm,确保连接可靠性;③ 阻燃等级UL94V-0,符合电子设备安全规范,降低火灾风险。

四、典型应用场景

因小间距、立贴安装及宽温特性,该针座广泛应用于以下领域:

  1. 消费电子:智能手机周边配件(无线充电器、蓝牙耳机)、便携式音频设备、小型智能家电(智能灯泡、加湿器)的内部连接;
  2. 汽车电子:车载小模块(胎压传感器、LED氛围灯控制器)的信号传输;
  3. 可穿戴设备:智能手环、手表的电池与主板连接、传感器模块(心率/血氧)连接;
  4. 工业控制:小型传感器节点(温度/湿度传感器)、微型PLC模块的板间连接。

五、产品优势与适用价值

  1. 高密度小型化:1.25mm间距适配当前电子设备轻薄化趋势,满足PCB空间紧张的设计需求;
  2. 可靠连接保障:磷铜触头+锡镀层确保低接触电阻,LCP塑料抗变形,宽温范围覆盖极端环境;
  3. 工艺适配性强:立贴SMD安装兼容自动化SMT生产线,减少人工装配成本,提升生产效率;
  4. 安全合规:UL94V-0阻燃等级符合国际安全标准,触头无铅镀层(符合RoHS规范),适配环保要求。

六、选型与使用注意事项

  1. 匹配建议:需搭配CJT GH系列线端连接器(如4P线端)使用,确保连接兼容性;
  2. 焊接工艺:SMD立贴焊接温度需控制在≤260℃(单次焊接时间≤10秒),避免塑料主体变形;
  3. 环境防护:避免在强腐蚀(硫化环境)、高湿度(>90%RH)环境中无防护使用,如需防水需搭配密封胶圈;
  4. 存储要求:未使用产品需存储在干燥(RH≤60%)、常温(15℃~25℃)环境,避免触头氧化。

该产品凭借稳定的性能与适配性,成为小型电子设备连接方案的优选组件之一。

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