WMSIC Electronic Components

Chilisin BMRA000404206R8MA1

ModelBMRA000404206R8MA1
PackageSMD,4.6x4.1x2mm
Brandchilisin
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
chilisin BMRA000404206R8MA1
Type
CHILISIN
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHILISIN
Electronic Component
BMRA000404206R8MA1
Electronic Component
1
Package
SMD,4.6x4.1x2mm
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.034g
Inductor
6.8uH
Electronic Component
1
Electronic Component
BM0265446698
Current
2A
Resistor(DCR)
135mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BMRA000404206R8MA1 磁胶屏蔽功率电感产品概述

一、产品定位与核心优势

BMRA000404206R8MA1是奇力新(Chilisin)针对小型化、低EMI要求的电源电路推出的磁胶屏蔽贴片功率电感,核心价值集中在三个维度:

  1. 电磁干扰控制:磁胶包裹磁芯结构,漏磁仅为非屏蔽电感的1/5,大幅降低对周边射频、传感器等敏感元件的干扰,满足消费电子、汽车电子的EMC标准;
  2. 空间效率:4.6×4.1×2mm紧凑封装,适配高密度PCB布局,可集成到10mm×10mm以内的电源模块,适合便携设备、微型电源等空间受限场景;
  3. 效率与电流承载:低DCR(135mΩ)减少热损耗,2A额定电流+2.5A饱和电流满足中小功率电源的持续与峰值需求,平衡性能与成本。

二、关键电气参数详解

该电感参数精准匹配主流中小功率电源设计,核心参数需重点关注:

  • 电感值与精度:6.8μH ±20%,电感值稳定(温度系数≤±10%/℃),无需额外补偿即可满足Buck/Boost电路的滤波、储能需求;
  • 电流能力:
    • 额定电流(Irms=2A):持续工作时电感值变化≤10%,性能稳定;
    • 饱和电流(Isat=2.5A):峰值电流上限,超过后电感值快速下降(典型降30%),设计需预留10%-20%余量;
  • 直流电阻(DCR=135mΩ):相同电流下热损耗(I²R)比常规电感低15%以上,提升电源转换效率(如5V/2A输出效率可达92%);
  • 屏蔽特性:屏蔽率≥80%,可直接靠近射频模块布局,简化EMI设计流程。

三、封装与物理特性

  • 封装形式:SMD贴片封装,适配自动化SMT生产线,回流焊温度符合J-STD-020标准(峰值260℃,持续10秒),无焊接缺陷风险;
  • 尺寸规格:长4.6mm×宽4.1mm×高2mm,比传统功率电感小30%,可替代0805封装电感用于更高电流场景;
  • 结构可靠性:铁氧体磁芯+磁胶包裹,抗振动(20-2000Hz,1g加速度)、耐冲击(1000g,0.1ms),适合车载、工业等振动环境。

四、典型应用场景

该电感因“小尺寸+低EMI+高电流”的组合优势,广泛覆盖以下场景:

  1. 消费电子便携设备:智能手机、平板、智能手表的快充电源(如18W Buck降压电路),2A电流满足日常充电需求,磁胶屏蔽避免干扰蓝牙/WiFi;
  2. 小型开关电源:USB-C充电器、移动电源的5V/2A输出模块,小尺寸节省空间,低DCR提升转换效率;
  3. 汽车电子辅助模块:车载USB充电器、仪表盘背光电源,符合ISO 11452 EMC标准,抗振动特性适配车载环境;
  4. 物联网设备:传感器节点、智能门锁的低功耗电源,6.8μH电感匹配1MHz以下开关频率,稳定储能滤波。

五、可靠性与适用环境

  • 温度范围:工作温度-40℃至+125℃,覆盖消费电子、工业、汽车的常规环境;
  • 可靠性测试:通过盐雾测试(48小时)、湿度测试(85℃/85%RH,1000小时),性能衰减≤5%;
  • 批量一致性:奇力新自动化生产工艺确保参数一致性(电感值偏差≤10%),适合大规模量产,降低供应链风险。

总结:BMRA000404206R8MA1是一款性能均衡的中小功率电感,兼顾空间效率、EMI控制与电流承载,适用于从便携设备到汽车电子的多场景电源设计,是高密度PCB布局的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.