WMSIC Electronic Components

CONSONANCE CN3304

ModelCN3304
PackageSOP-8
BrandCONSONANCE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CONSONANCE CN3304
Type
CONSONANCE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CONSONANCE
Electronic Component
CN3304
Electronic Component
1
Package
SOP-8
Electronic Component
Battery Management
Electronic Component
0.105g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0257674188
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~6.5V
Battery Type
Battery
Battery
4
ICType
IC
Static Current(Iq)
2uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CN3304 产品概述

一、产品简介

CN3304 是 CONSONANCE(上海如韵)推出的一款用于锂电池组的充电/DC-DC 电源控制芯片。器件采用外置元件驱动方案,封装为常见的 SOP-8,适合工业与消费类设备的高电流充电场景。芯片针对四节锂电池(4S)设计,能与外部开关器件、感性元件和检测元件配合工作,实现对电池的稳健充电与电源管理。

二、主要技术参数

  • 芯片类型:充电芯片 / DC-DC 控制器(外置器件)
  • 工作电压:2.7V ~ 6.5V(芯片供电/输入范围)
  • 最大充电电流:10.5A(通过外部功率器件实现)
  • 充电饱和电压:16.8V(适配 4 节锂电池)
  • 电池类型:锂电池,电池节数:4 节(4S)
  • 工作温度:-40℃ ~ +85℃
  • 静态电流(Iq):2μA(低静耗设计)
  • 封装:SOP-8(外置布线、器件便利)

三、性能亮点

  • 高效大电流:支持最高 10.5A 的充电电流,适合对充电速度有较高要求的应用。
  • 低静态功耗:2μA 的静态电流使得系统待机损耗极低,有助于延长系统整机待机时间。
  • 宽温工作:-40℃ 至 +85℃ 的工业级温度范围,适应复杂环境。
  • 模块化设计:SOP-8 外置方案便于用户根据负载和散热需求选择 MOSFET、电感和电阻,灵活性高。

四、典型应用场景

  • 便携式动力工具、无人机等需要快充的大电流充电系统;
  • 电动自行车/E-bike 的车载充电模块(配合外部电源拓扑);
  • 工业电源与备用电池充电管理;
  • 需要低待机损耗且支持 4S 锂电池的各类智能设备。

五、设计与布局建议

  • 功率路径尽量缩短、加宽走线,关键元件(MOSFET、电感、电容、取样电阻)靠近芯片布局;
  • 外部 MOSFET 选择低 RDS(on) 器件以降低发热,确保在 10A 级别下有充足的散热余量;
  • 取样电阻需按目标充电电流精确选型并注意功率余量;建议并用并联电阻或选择高功率封装;
  • 输出与输入滤波电容采用低 ESR 类型,保证稳压与纹波控制;SOP-8 的散热需通过铜箔与过孔改善;
  • 系统应配合外部过流、过压、反接与温度监测保护电路,提升可靠性。

六、注意事项与可靠性建议

  • 虽然芯片本身静态电流低,但在高充电电流下系统发热主要来自外部功率器件,请做充分热设计;
  • 输入电压低于 2.7V 或高于 6.5V 可能导致器件无法正常工作或损坏,需在系统层面加以限制;
  • 在极端温度工况下关注器件参数漂移,必要时加入温度补偿与功率降额策略;
  • 推荐在开发阶段进行 EMC 与热循环测试,确保长期可靠性。

如需参考典型应用电路、器件选型建议或 PCB 布局示意,可提供系统工作条件与功率目标,我可以进一步给出详细设计建议。

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