Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CrossChip CC6207MST
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Cross Chip CC6207MST
- Type
- CROSSCHIP
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CROSSCHIP
- Electronic Component
- CC6207MST
- Electronic Component
- 1
- Package
- SOT-23
- Type
- Electronic Component
- Electronic Component
- Hall Switch
- Electronic Component
- 0.049g
- Electronic Component
- 1
- Electronic Component
- BM0209692301
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 5V
- Sampling Frequency
- 32Hz
- (Gs)
- ±2mT
- (Gs)
- ±1.5mT
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC6207MST 产品概述
一、产品概述
CC6207MST是由成都芯进（CrossChip）推出的一款微功耗全极性霍尔开关，采用SOT-23封装，具有低功耗、全极性检测和高灵敏度等特点。该产品专为各种应用设计，特别是在需要高精度位置和运动检测的场合，其32Hz的工作频率及±20Gs的加速度测量能力使其在微型传感器领域具有广泛的应用前景。
二、主要特点
低功耗：CC6207MST在微功耗设计下，能够在极低的电流消耗条件下正常工作，适合要求电池续航的便携式设备，尤其是采用电池供电的传感器和控制器。
全极性霍尔开关：该设备具备全极性检测能力，可以在磁场的正负极性变化下正常工作。这使得CC6207MST适用于各种磁场-sensitive传感器应用，能够检测到磁场的方向和强度变化。
高灵敏度：其±20Gs的加速度测量范围，满足高灵敏度应用场合，如智能手机、可穿戴设备、隐形眼镜等产品的运动检测需求。
方便的封装：SOT-23封装形式小巧，便于集成到各类电路板上，适合空间受限的应用。其标准化的封装形式使得开发和生产更为方便。
工作频率：CC6207MST的工作频率为32Hz，能够良好地适应并满足大多数传感器应用的要求，提供足够的响应速度来捕捉迅速变化的信号。
三、应用领域
CC6207MST的应用范围广泛，具体包括但不限于以下领域：
消费电子产品：如智能手机、平板电脑和可穿戴设备，CC6207MST可以用于自动屏幕旋转、对运动姿态的监测等功能。
工业自动化：在自动化设备中用于监测机械运动或位置检测，确保设备在指定的工作条件下正常运行。
汽车电子：在汽车电子产品中，该霍尔开关可用于车门开关、轮速传感器等。
医疗设备：在医疗监测设备中，利用低功耗特点，可实现长期监测而无需频繁更换电池。
智能家居：在智能家居设备中，可以用于运动感应和位置监测，提高设备的交互性与智能化程度。
四、总结
总之，CC6207MST是一款性能卓越、设计精良的微功耗全极性霍尔开关，凭借其独特的电气特性和灵活的应用场景，适合在多个行业和应用中发挥作用。随着物联网及智能设备的迅猛发展，基于该产品的创新应用将会推动更多智能产品的问世，帮助实现更加智能、便捷的生活方式。
由于其优越的性能和广泛的适用性，CC6207MST无疑是在电子元器件领域中的一款杰出产品，值得开发者和工程师的信赖与选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
