Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CC6920BSO-20A 是 CrossChip(成都芯进)推出的一款单芯片差分霍尔电流传感器,采用 SOP-8 封装,面向要求高隔离、电流双向测量和宽频带响应的电源、逆变器及电机驱动等应用场景。器件集成霍尔元件与磁路设计,能在高共模隔离条件下实现零磁饱和、低电阻导流端和宽带宽的电流测量,支持 -20A 到 +20A 的双向测量范围,适合以 3.3V 供电的数字采集系统。
说明:差分灵敏度 66 mV/A 意味着差分输出随电流变化的幅度为 66 毫伏每安培;在满量程 ±20A 时,差分输出变化约为 ±1.32 V。
CC6920BSO-20A 采用 SOP-8 封装,便于自动贴装与大规模量产。工作温度覆盖 -40 ℃ 至 +125 ℃,可胜任大多数工业级环境。3500 Vrms 隔离能力满足工业控制与能量转换系统的安全隔离要求。建议参照完整机械图与焊接规范进行 PCB 设计与制造。
CC6920BSO-20A 适用于需要高隔离、低功耗损耗、快速响应和双向电流测量的场合。欲获得器件脚位定义、电气典型曲线、温漂特性及详细参考电路,请参考 CrossChip 官方数据手册或联系供应商技术支持,以确保在目标系统中实现最佳性能与可靠性。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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