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DIODES DMP3099L-7 DMP3099L
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES DMP3099L-7
- Type
- DIODES
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- DMP3099L-7
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0000281103
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.08W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DMP3099L-7 产品概述
概述
DMP3099L-7 是一款高性能的 P 通道增强型金属氧化物半导体场效应管（MOSFET），具有卓越的电气特性和高度的可靠性。该器件特别设计用于要求高效能和小尺寸的电源管理应用，如开关电源、DC-DC 转换器和负载开关。其采用 SOT-23 封装，适合表面贴装技术（SMD），便于自动化生产和紧凑型布局，为现代电子产品的设计提供了很大的便利。
主要规格
电气参数
漏源电压（Vdss）: 30V
该参数表明器件能够承受的最大漏极与源极之间的电压，使其可广泛应用于许多低压直流电源管理电路。连续漏极电流（Id）: 3.8A（25°C 时）
DMP3099L-7 可在25°C环境下安全地传导高达3.8A的电流，使其适用与需要支撑较高负载的情境。栅源极阈值电压（Vgs(th)）: 2.1V @ 250µA
此参数显示了栅极开启所需的最小电压，具有较低的阈值电压，有利于减少驱动电路的复杂度，使器件在较低的驱动电压下保持良好的导通状态。漏源导通电阻（Rds(on)）: 65mΩ @ 3.8A,10V
该规格表明在最大连续电流下，漏极到源极的通导电阻值，相对较低的导通电阻有助于降低系统的功耗，提高整体效率。最大功率耗散: 1.08W @ Ta=25°C
最大功率耗散的参数保证了在给定环境温度下器件的安全工作，进一步保证了整个系统的可靠性。
工作环境参数
- 工作温度范围: -55°C ~ 150°C
广泛的工作温度范围使得 DMP3099L-7 能够在严苛的环境条件下稳定运行，适用于工业、汽车和航空航天领域。
封装与安装
DMP3099L-7 采用 SOT-23 封装（TO-236-3, SC-59），其紧凑的尺寸使其非常适合高密度的电路板设计。这种封装形式不仅可以显著节省电路板空间，还可以提高散热性能，有助于器件在较高功率情况下的稳定运行。表面贴装技术的兼容性也使得该器件易于在现代制造环境中实现自动化装配。
应用领域
DMP3099L-7 的设计和性能使其非常适用于以下应用场合：
- DC-DC 转换器
- 电池管理系统
- 负载开关
- 电源管理电路
- 移动设备和消费电子
总结
综上所述，DMP3099L-7 是一款集成了高性能、多功能和可靠性于一体的 P 通道 MOSFET，适合用于各类电源管理和开关应用。其卓越的电气特性、宽广的工作温度范围以及紧凑的封装形式，使其成为现代电子设计中不可或缺的优秀元件。通过选用 DMP3099L-7，工程师可以在维护高效性能的同时，也能减小整个系统的体积，提高设计灵活性。
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