Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES DMG2301U-7 DMG2301U
Configuration
1 options
Configuration
Date code within 2 years
Availability on request
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES DMG2301U-7
- Type
- DIODES
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- DMG2301U-7
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0000282663
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 800mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DMG2301U-7 产品概述
产品背景
DMG2301U-7是一款高性能的P沟道MOSFET，适用于需要高效能和可靠性的电路应用。这款器件由知名半导体制造商DIODES（美台公司）生产，采用SOT-23封装，适合表面贴装技术（SMT）。作为一款20V、2.5A的场效应管，DMG2301U-7在低电压高电流的控制场合中表现尤为出色，带来良好的性能与热管理方案。其广泛应用于开关电源、负载开关、音频放大器及其他电子设备中。
主要特性
- 漏源电压（Vdss）: 该器件具有20V的漏源电压，适合大多数低电压应用。
- 连续漏极电流（Id）: 25°C时连续漏极电流可达2.5A，能够满足多种负载需求。
- 导通电阻（Rds on）: 在2.8A和4.5V的驱动电压下，漏源导通电阻为130毫欧，这确保了器件在工作过程中功耗的降低，提高了能效。
- 栅源极阈值电压: 栅源阈值电压为1V（@ 250uA）意味着该MOSFET能够在较低的电平下开发出有效的导通能力，降低了所需的控制电压。
- 最大功率耗散: 在25°C环境下，最大功率耗散为800mW，有助于器件在高负载条件下安全稳定地运行。
- 广泛的工作温度范围: 适应-55°C至150°C的工作温度范围，使得DMG2301U-7可以在严酷环境下运行，保证了产品的可靠性与耐久性。
结构与封装
DMG2301U-7采用SOT-23-3封装，尺寸小巧，便于在空间受限的应用中使用。其表面贴装设计提高了安装的灵活性和效率，同时也有助于热量的快速散发，进一步增强了器件的稳定性和可靠性。
应用场合
- 开关电源: DMG2301U-7可以作为高效的开关元件，用于控制电源的开启与关闭，帮助实现功率管理和节能。
- 负载开关: 在低电平控制条件下，可以快速、有效地处理负载切换，支持各种家用电器和工业设备的自动化控制。
- 音频设备: 在音频放大器中，该器件可用于信号路径中的开关，保证音频信号的高保真传输。
- LED驱动: 在LED照明应用中，作为驱动开关，提供高效且稳定的电流管理，确保LED的正常工作。
竞争优势
与同类产品相比，DMG2301U-7展现出了较低的导通电阻和较高的电流处理能力，尤其是在低功率供电应用中的优势使其成为优选。其卓越的热性能，结合多种封装选项，为设计师在不同应用场合的设计提供了灵活性。另外，DIODES作为一家有声望的半导体制造商，其产品通常具有良好的质量保证和技术支持，使得客户在应用该器件时更有信心。
结论
DMG2301U-7是一款集成了高效性能与良好热管理的一体化解决方案，适用于各类低电压应用场合。无论是开关电源、负载控制，还是音频信号处理，该器件都能够提供高效、稳定的性能表现，是电子设计工程师值得考虑的优质选择。通过符合广泛电气和环境标准，该MOSFET为电子产品的可靠性和安全性奠定了坚实的基础。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
