Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS1J-13-F 是一款由 DIODES(美台)公司生产的高效快恢复二极管,专为各种电子应用设计,具有良好的性能和可靠性。该产品在电气参数、封装特性和工作环境方面都展现出其在现代电子电路中不可或缺的重要性。
反向耐压(Vr): RS1J-13-F 的直流反向耐压高达 600V,使其能够适应大多数高电压环境,确保其在严苛的工作条件下仍能安全可靠地工作。这一特性使其在各种电源转换和整流电路中非常受欢迎。
平均整流电流(Io): 该二极管的平均整流电流为 1A,能够处理相对较大的电流负载,适用于许多工业和消费电子应用场景。其整流能力使得它在电源适配器、充电器及其他需要电流转换的设备中表现出色。
正向压降(Vf): 在 1A 电流下,RS1J-13-F 的正向压降为 1.3V。较低的正向压降意味着在工作时产生的热量相对较低,从而提高了整个系统的能效,并降低了散热需求。
反向恢复时间(trr): 该二极管的反向恢复时间为 250ns,属于快速恢复二极管类型。这一特性在高频开关应用中尤为重要,能够确保在切换状态时能快速恢复,减少反向恢复损耗,从而提高电路的整体效率。
反向泄漏电流: 在 600V 的高电压条件下,RS1J-13-F 的反向泄漏电流仅为 5µA,这显示出其优良的绝缘性能,有助于降低待机功耗。
工作温度范围: 此二极管的结温工作范围达 -65°C至 150°C,表明其在苛刻环境下的稳定性,适合于各种温度波动较大的应用。
电容特性: 在 4V 和 1MHz 条件下,二极管的电容为 15pF,表明其在反向偏置情况下的良好高频特性,使其能够适应更高频率的信号处理。
RS1J-13-F 采用 SMA 封装(DO-214AC 类型),这是一种表面贴装型的封装形式,适合于现代自动化生产线,便于实现高度集成和小型化设计。此外,其封装设计有助于提高散热效果,增强了产品的整体可靠性。
RS1J-13-F 适用于多种电气和电子应用,包括:
RS1J-13-F 作为一款高可靠性快恢复二极管,凭借其优秀的电气性能和极宽的应用领域,成为电子设计工程师们在设计电源管理解决方案时的首选器件。它的高效能和可靠性,使其在现代电子设备和系统中的表现卓越,是实现高性能、高效率电子产品的理想选择。无论是在新颖的消费产品还是在传统的工业设备中,RS1J-13-F 二极管都能够发挥其应有的作用,确保电路运行的稳定性与高效性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products