Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC846BLP4-7B 是一款由美台半导体(DIODES)生产的高性能 NPN 晶体管,旨在满足广泛的电子应用需求。其小型表面贴装型封装(DFN-3, 1 x 0.6 mm)使其在空间受限的应用场合中表现突出,非常适合用于消费电子、通信设备和工业控制等领域。
类型与结构:作为一款 NPN 晶体管,BC846BLP4-7B 的基本结构使其在开关和放大电路中具有卓越的性能。NPN 类型晶体管的特点是当基极流入电流时,集电极与发射极之间能够导通,为设计师提供了灵活的电流控制解决方案。
电流与电压能力:
功率和效率:该晶体管的最大功率为 410mW,确保其在高负载情况下仍然可以稳定工作。其饱和压降 Vce(饱和)为 600mV(在 5mA 和 100mA 时),有助于提高电路的效率,降低能量损耗。
小型封装与高频特性:BC846BLP4-7B采用 3-XFDFN 封装,其小巧的体积让它能够轻松被集成到紧凑的电路板中。此外,该晶体管的跃迁频率高达 300 MHz,使其特别适用于高频应用,例如射频信号放大器和开关电源设计。
温度范围与可靠性:其工作温度范围为 -55°C 至 +150°C,保证了在恶劣环境下的可靠运行,适用于汽车电子、工业设备及航空航天应用等高要求的环境。
电流增益:在 2mA 的测试条件下,该器件的 DC 电流增益(hFE)最小值为 200,这意味着即使仅施加小的基极电流,也能获得相对较高的集电极输出电流,增强了其放大作用的效率。
BC846BLP4-7B 的设计使得它适用于多种电子控制和信号处理应用,包括但不限于:
BC846BLP4-7B 是一款非常灵活且高效的 NPN 晶体管,凭借其优异的电流承载能力、低功耗、高频性能和良好的工作温度范围,成为众多电子设计师的首选器件。无论是用于商业产品还是专业设备,其性能都能满足严苛的应用要求,凭借 DIODES 的品质保证,用户可以放心集成到各类电子产品中。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products