WMSIC Electronic Components

DIODES DDTC114YCA-7-F DDTC114YCA

ModelDDTC114YCA-7-F
PackageSOT-23
BrandDIODES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
DIODES DDTC114YCA-7-F
Type
DIODES
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
DIODES
Electronic Component
DDTC114YCA-7-F
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.043g
Electronic Component
1
Electronic Component
BM0000280649
Operating Temperature
55℃~+150℃
Resistor
10kΩ
Transistor Type
NPN
Frequency(f T)
250MHz
Power Dissipation(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:DDTC114YCA-7-F 数字晶体管

一、产品简介

DDTC114YCA-7-F 是由DIODES(美台)公司推出的一款高性能数字晶体管,采用NPN结构,具有优良的电气特性和广泛的应用前景。该器件为预偏压型晶体管,专为低电流和低功率应用设计,具有高增益和快速开关特性,适合用于高频率的模拟和数字电路中。封装类型为SOT-23,适合表面贴装,便于自动化生产和空间优化设计。

二、关键参数

  1. 额定功率:DDTC114YCA-7-F 的最大功率为200mW,适合在低功率环境中使用,能够有效减少能耗并提高电路的整体效率。
  2. 集电极电流(Ic):该晶体管的集电极电流最大值为100mA,保证了在多数应用场景下的稳定工作。其基极电阻(R1)为10 kΩ,发射极电阻(R2)为47 kΩ,组合使用能够有效控制电流放大。
  3. 集射极击穿电压(Vce):其最大集射极击穿电压为50V,使得该器件能够在较高电压条件下安全运行,适应多种电源环境。
  4. 频率响应:频率跃迁高达250MHz,适合用于高速信号处理与放大,能够满足现代数字电路对高频率的需求。
  5. 电流增益(hFE):在Ic=5mA和Vce=5V的条件下,该晶体管的电流增益(hFE)最小值为68,能够实现高效的信号放大。
  6. 饱和压降:在250µA的基极电流和5mA的集电极电流条件下,Vce饱和压降最大值为300mV,能够保证开关操作时的低损耗,有效提高电路效率。

三、应用场景

DDTC114YCA-7-F广泛应用于各种电子设备,主要可用于以下场景:

  • 开关电路:由于其良好的开关特性,该晶体管可用作温度、光电和压力传感器的开关元件,控制外部负载。
  • 放大电路:凭借其高增益和频率特性,DDTC114YCA-7-F非常适合用于信号放大器,例如在音频设备和射频放大器中。
  • 数字电路:由于其独特的预偏置特性,可以用作逻辑门或数字电路的基础元件,支持更复杂的数字处理。
  • 低功耗设备:200mW的额定功率使其非常适合于便携式和无线设备,以延长电池寿命。

四、封装与电路设计

DDTC114YCA-7-F采用SOT-23封装,相较于传统封装,具有更小的尺寸和重量,适合现代电子设备对电路小型化的要求。该封装也使得设计师能够实现更高的组件密度,进一步优化PCB布局。

五、总结

总的来说,DDTC114YCA-7-F是一款性能优越的NPN数字晶体管,以其高增益、低功耗和优良的频率响应,成为现代电子设计中不可或缺的重要元件。无论是在家用电器、配件还是工业控制中,都展现出强大的适应性与灵活性。借助于其表面贴装封装及稳定的电气特性,DDTC114YCA-7-F为电子工程师提供了可靠的解决方案,支持各种创新和高效的电路设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.