Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES AZ431LBNTR-G1 AZ431LBNTR
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES AZ431LBNTR-G1
- Type
- DIODES
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- AZ431LBNTR-G1
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Voltage Reference IC
- Electronic Component
- ±1%
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0226643760
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.24V~18V
- Electronic Component
- 20ppm/℃
- Output Voltage
- 1.24V~18V
- Output Current
- 100mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AZ431LBNTR-G1 产品概述
概述
AZ431LBNTR-G1是一款高性能的可调式精密电压基准芯片，由DIODES（美台）公司提供。这款芯片不仅具备优越的稳定性和准确性，而且能够在广泛的应用场景中确保可靠的电压输出。它的输出电压范围从1.24V到18V，适用于需要精密电压参考的各类电子设计和产品。
关键参数
AZ431LBNTR-G1的核心参数包括输出电压、输出电流、工作温度范围、封装类型等。具体参数如下：
- 输出电压范围：1.24V（最小值）至18V（最大值），这使得该芯片能够适应多种电路设计需求。
- 输出电流：最大输出电流为100mA，能够为各种负载提供足够的电流。
- 工作温度：适用温度范围广泛，能够在-40°C至125°C的环境中稳定工作，适合恶劣环境下的应用。
- 精度：具有±1%的电压精度，确保输出电压的可靠性和一致性。
- 温度系数：标准为20ppm/°C，表明在温度变化时，输出电压的变化非常微小，进一步提升了电压的稳定性。
引脚配置与封装
AZ431LBNTR-G1采取SOT-23封装，尺寸小巧，适合表面贴装（SMD）技术，便于自动化生产。SOT-23封装使得该芯片在电路板上占用较少空间，有利于紧凑型设备的设计与布局，提升产品的整体性能与经济性。
应用场景
AZ431LBNTR-G1广泛应用于以下几个领域：
- 电源管理：在开关电源、线性电源等电源管理系统中，作为电压基准源，提供稳定的参考电压。
- 医疗设备：医疗器械通常要求高可靠性和长期稳定性，AZ431LBNTR-G1能够满足这些应用需求。
- 通信设备：在通信电路中，该芯片可用作电压监控和调节，提高设备的信号稳定性。
- 工业控制：在各种工业设备中，作为反馈电压，确保控制系统的精确性。
优势与特性
- 高稳定性和低漂移：AZ431LBNTR-G1能够在广泛的温度范围内维持其输出电压的稳定性，适合各种环境条件下的应用。
- 便于集成：小型的SOT-23封装使得AZ431LBNTR-G1能够轻松集成到各种电路设计中，特别是空间受限的应用。
- 改善的电能利用效率：最大100mA的输出电流能力意味着它能够高效地为多个电路部分供电，而不需要额外的电压调节器。
结论
AZ431LBNTR-G1是一款功能强大的可调式电压基准芯片，凭借其低漂移、高准确度与广泛的工作温度范围，成为电子设计师们在多种应用中的理想选择。在电源管理、工业控制和通信等领域，这款芯片确保了电路的稳定性和可靠性，为终端产品的高性能打下了坚实的基础。在复杂的现代电子产品设计中，AZ431LBNTR-G1能够有效提升系统的整体性能与效率，是一款不可或缺的关键元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
