Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES 74LVC2G07FW4-7 74LVC2G07FW4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES 74LVC2G07FW4-7
- Type
- TDFN-6(1X1)
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- 74LVC2G07FW4-7
- Electronic Component
- 1
- Package
- TDFN-6(1x1)
- Electronic Component
- Buffers / Drivers / Transceivers
- Electronic Component
- 74LVC
- Electronic Component
- 0.03g
- Electronic Component
- 2
- Electronic Component
- 1
- Features
- Isolated; Level Conversion
- Electronic Component
- BM0227114143
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.65V~5.5V
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74LVC2G07FW4-7 产品概述
一、产品简介
74LVC2G07FW4-7 是 DIODES（美台）系列中的双通道 CMOS 数字缓冲器，输出为开漏（open-drain），每通道为单向缓冲。器件工作电压范围宽（1.65V ～ 5.5V），适用于低电压与传统 5V 系统的接口场景。器件采用小尺寸 TDFN-6（1×1 mm，X2-DFN1010-6）封装，适合空间受限的表贴设计。
二、主要电气参数
- 工作电压（VCC）：1.65V ～ 5.5V
- 通道数：2（双通道）单向缓冲
- 输出类型：开漏（需外部上拉）
- 灌电流 IOL：32 mA（可实现较强下拉能力）
- 静态电流 IQ：典型 10 µA（低静态功耗）
- 传播延迟 tpd：2.9 ns @ 5V，CL = 50 pF
- 工作温度范围：-40 ℃ ～ +125 ℃
三、封装与机械信息
- 封装形式：TDFN-6（1×1 mm，X2-DFN1010-6）小型 DFN 表面贴装
- 适合高密度 PCB 布局，便于自动贴装与回流焊工艺
四、典型应用场景
- 电平转换与总线接口：因工作电压范围广，可用于不同电源域间的下拉/开漏接口（需配上拉电阻）
- 信号线驱动与隔离：用于需要可控下拉的控制或状态信号驱动
- 外围器件控制：可直接下拉开关型负载或作为片选/中断线的驱动单元（同时注意功耗与热耗散）
- 嵌入式与移动设备：小封装、低静态电流适合电源受限或体积受限的系统
五、设计与使用注意事项
- 开漏输出需配置外部上拉电阻，上拉电阻值与上拉电压应根据所需上升时间与功耗平衡选择；若驱动高速信号，应使用较小阻值的上拉或主动上拉方案。
- 推荐在 VCC 端靠近器件放置去耦电容（例如 0.1 µF），以抑制电源瞬态并保证时序性能。
- PCB 布局建议缩短关键信号与上拉电阻之间的连线，避免长走线形成寄生电感、电容影响上升/下降沿。
- 热管理：尽管器件为低功耗设计，但在高频高电流工作（如频繁大电流下拉）时要关注局部热量积累，视情况增加散热通孔或铜箔面积。
- 参考器件数据手册中的时序、负载与绝对最大额定值，避免超出器件规格范围。
六、优势小结
该器件结合了宽电源电压、较强下拉能力（32 mA）、低静态电流与小尺寸封装，适合需要可靠开漏输出、节省 PCB 面积和低功耗要求的现代电子设计。对需要兼容多电平接口和高密度布局的产品开发尤为合适。
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