WMSIC Electronic Components

DIODES DMP2075UVT-13 DMP2075UVT

ModelDMP2075UVT-13
PackageTSOT-26
BrandDIODES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIODES DMP2075UVT-13
Type
DIODES
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIODES
Electronic Component
DMP2075UVT-13
Electronic Component
1
Package
TSOT-26
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.023g
Electronic Component
1
Electronic Component
BM0084328037
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
10000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DMP2075UVT-13 产品概述

简介

DMP2075UVT-13是由美台(Diodes)公司推出的一款高性能P沟道金属氧化物半导体场效应晶体管(MOSFET)。此器件设计用于高效能开关应用,具备出色的功耗特性、优良的导通性能,并且宽范围的工作温度使其非常适合多种电子设备和电路的需求。DMP2075UVT-13的封装采用TSOT-26类型,这种表面贴装型设计可以有效节省PCB空间,适合高密度的电子设计。

主要特性

  • 类型与技术:该器件属于P通道MOSFET技术,尤其适用于需要导通高速与低导通电阻的应用。
  • 电压和电流规格:DMP2075UVT-13的漏源电压(Vdss)为20V,维持在该电压下可以承受高达3.8A的连续漏极电流(Id)直至环境温度(Ta)达到25°C。
  • 导通电阻:在4.5V的栅源电压(Vgs)下,器件的最大导通电阻(Rds(on))仅为75毫欧,这为降低功耗、提高效率以及减少热量的产生提供了良好的条件。
  • 栅极阈值电压:DMP2075UVT-13的栅源阈值电压(Vgs(th))最大值为1V @ 250µA,这使得该器件在低电压驱动的应用中表现优越。
  • 输入电容:在10V的漏源电压下,最大输入电容(Ciss)可达642pF,能够支持快速的开关速度,适合PWM调制和其他高速电源管理应用。
  • 功率耗散与温度范围:该MOSFET的最大功率耗散为1.2W,并且具有广泛的工作温度范围,从-55°C到150°C,确保在严苛环境下的稳定性和可靠性。
  • 栅极电荷:在4.5V下的栅极电荷(Qg)最大值为8.8nC,这有助于减小驱动电路的功耗及复杂度。

应用领域

DMP2075UVT-13适合用于众多应用场景,包括但不限于:

  1. 开关电源:由于其低导通电阻和高速开关能力,DMP2075UVT-13非常适合在高效开关电源中作为开关管使用,从而提高整体功率转换效率。
  2. 电机驱动:其出色的电流承载能力和低温升特性使该器件能够有效驱动各类小型电机与步进电机,应用于家用电器、自动化设备等领域。
  3. 负载开关:可以作为负载开关使用,在需要快速开关的场合,能够提供低的导通损耗和快速的响应时间。
  4. LED驱动:因其良好的电流控制能力,适合用于LED照明应用中,实现高效的驱动和控制。
  5. 便携式设备:其小型封装和优良的热管理特性使该器件适合用于便携式电子产品中,有助于改善产品整体的性能和续航能力。

总结

DMP2075UVT-13作为一款高效P通道MOSFET,兼具高电流、高电压及低导通电阻特性,以满足多样化的电子应用需求。该器件不仅确保了高效能和低功耗,而且兼具良好的热稳定性及宽泛的工作温度范围,是设计师们在选择MOSFET时的理想选择。无论是在新产品设计,还是在现有产品的性能优化上,DMP2075UVT-13都能提供强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.