Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES BC857BS-13-F BC857BS
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIODES BC857BS-13-F
- Type
- DIODES
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- BC857BS-13-F
- Electronic Component
- 1
- Package
- SOT-363
- Electronic Component
- 2 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0177322098
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 200MHz
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC857BS-13-F 产品概述
1. 简介
BC857BS-13-F是一款高性能的PNP型晶体管，属于双极型晶体管（BJT），专门设计用于在高频、大电流和宽工作温度范围内的电子应用。它以其优越的电气性能、稳定性和高增益特性，成为电子设备设计中一种理想的选择。
2. 基本参数
BC857BS-13-F具有以下主要参数：
- 最大集电极电流（Ic）: 100mA。该参数保证了在正常运行条件下，晶体管可以承受的集电极电流最大值。
- 最大集射极击穿电压（Vce): 45V。该特性使得BC857BS-13-F适用于高电压的应用场景，确保其在不同工作环境下的可靠性。
- 饱和压降（Vce(sat)）: 最大值为400mV，测试条件为5mA和100mA。当晶体管处于饱和状态时，这一参数的低值意味着功耗更低，效率更高。
- 截止电流（ICBO): 最高可达15nA，表示在集电极被打开时，晶体管的漏电流极小，有效提升了电路的效率。
- DC电流增益（hFE): 最小值为220，在2mA电流和5V电压条件下规定。较高的hFE值使得该器件在放大应用中非常有效。
- 功率耗散（Ptot): 最多可达200mW，便于在各种功率应用中使用。
- 工作频率: 到达100MHz，适合高频应用，例如RF（无线频率）电路。
3. 工作范围
BC857BS-13-F能够在极端的环境条件下可靠地工作，工作温度从-55°C到150°C，这使得它能够适应各种严酷的应用，包括工业、汽车电子以及航空航天设备。
4. 封装与安装
该款晶体管采用表面贴装型设计，封装大小为SOT-363，常用的6-TSSOP或者SC-88格式。此小巧的封装而且散热性能良好，特别适合高密度电路板的设计，能够有效节省电路板空间。
5. 应用场景
BC857BS-13-F因其优异的参数和广泛的适用性，可广泛应用于多个场域，包括但不限于：
- 信号放大器: 可用于音频和射频放大电路，提供高增益和低噪声放大功能。
- 开关电路: 适用于低功耗开关应用，作为信号控制开关或驱动负载。
- 放大与匹配网络: 特别适合于使用在无线通讯系统中的输入输出匹配。
- 电源管理: 适合于电源开关和调节应用，可以优化功率损耗。
6. 总结
BC857BS-13-F作为一款PNP晶体管，不仅在电气性能上表现出色，而且在包装和可操作性上也具有显著的优势。其高增益、低饱和压降和出色的工作温度范围，使其在多种电子电路设计中都能发挥重要作用，无论是在消费类电子、工业控制还是高频通信领域，BC857BS-13-F都展现出极大的应用潜力和极高的使用价值。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
