Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES DESD3V3S1BLP3-7 DESD3V3S1BLP3
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES DESD3V3S1BLP3-7
- Type
- DIODES
- Unit
- Electronic Component
- Minimum package
- 10000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- DESD3V3S1BLP3-7
- Electronic Component
- 1
- Package
- DFN0603-2
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 10pF
- Electronic Component
- BM0248712577
- Operating Temperature
- 65℃~+150℃
- Voltage
- 7V
- Electronic Component
- IEC 61000-4-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DESD3V3S1BLP3-7 产品概述
一、产品简介
DESD3V3S1BLP3-7 是 DIODES（美台）推出的一款用于静电与浪涌保护的单路瞬态抑制二极管（TVS/ESD）。该器件以小尺寸 DFN0603-2 封装实现对 3.3V 信号线的高效保护，适合对体积、成本和防护性能有综合要求的便携与工业级电子设备。
二、主要参数与性能特点
- 反向截止电压 Vrwm：3.3V，针对 3.3V 工作电平优化；
- 击穿电压 Vbr：6.5V（典型）；钳位电压 Vclamp：7V（在 8/20µs、5A 峰值下）；
- 峰值脉冲电流 Ipp：5A @ 8/20µs，峰值脉冲功率 Ppp：35W @ 8/20µs；
- 反向漏电流 Ir：10nA（低泄漏利于电池供电设备）；结电容 Cj：10pF（对高速信号影响可控）；
- 通道数：单路；工作温度范围：-65℃ ~ +150℃；符合 IEC 61000-4-2 静电放电抗扰标准。
三、典型应用场景
适用于 3.3V 电平的接口与信号线路保护，如 GPIO、UART、I2C、SPI、蓝牙/射频天线前端、移动终端数据口、物联网节点及工业控制模块等，能在 ESD 或雷击浪涌事件中有效保护后级芯片不被损坏。
四、封装与 PCB 布局建议
DFN0603-2 小封装有助于节省 PCB 面积，但对布局要求较高：器件应尽量靠近被保护的连接器或器件引脚放置，保护二极管的接地回路要短且粗，确保快速将脉冲电流导入公共地；对于高速信号，注意结电容 10pF 对信号完整性的影响，可通过在源端增加小阻抗或使用差分对设计降低反射与串扰；如需提升耐冲击能力，可与串联阻抗或防护电阻配合使用。
五、可靠性与选型建议
该器件工作温度宽、低漏电、高脉冲吸收能力，使其适合严苛环境应用。选型时须平衡钳位电压与被保护芯片的最大承受电压、结电容对信号带宽的影响以及实际可能遭受的浪涌能量（Ipp/Ppp）。总体而言，DESD3V3S1BLP3-7 在紧凑设计中提供了对 3.3V 线的可靠 ESD/浪涌防护，是移动与工业电子产品的优选保护元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
