Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES ZVN3306FTA
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES ZVN3306FTA
- Type
- DIODES
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- ZVN3306FTA
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.29g
- Electronic Component
- 1
- Electronic Component
- BM0258955452
- Power Dissipation(Pd)
- 330mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ZVN3306FTA 产品概述
ZVN3306FTA是一款性能优越的N沟道MOSFET，广泛应用于各种电子设备中，尤其是在开关电源、控制电路以及信号放大等领域。其设计旨在提供高效的电流控制和较低的导通电阻，以满足现代电子设备日益严苛的性能需求。
主要参数
ZVN3306FTA的核心参数包括：
- 漏源电压（Vdss）: 60V
- 连续漏极电流（Id）: 150mA（在25°C环境温度下）
- 栅源阈值电压（Vgs(th)）: 2.4V @ 1mA
- 导通电阻（Rds On）: 5Ω @ 500mA, 10V
- 最大功率耗散: 330mW（Ta=25°C）
- 工作温度范围: -55°C ~ 150°C
- 封装类型: SOT-23-3
这些参数使得ZVN3306FTA非常适合用于低至中等功率应用，尤其是在高效率开关电源、LED驱动器和其他功率管理电路中。
关键特性
高效能设计: ZVN3306FTA具有较低的导通电阻，达到5Ω的目标值，这意味着在高电流运行时将产生较少的功率损耗。这使得其在开关电源应用中能够显著提高效率，从而减少热管理的复杂性。
较高的耐压能力: 该器件提供高达60V的漏源电压，这使得它能够处理多种应用场合的适用性，尤其是在高电压环境中。
宽工作温度范围: ZVN3306FTA的工作温度范围为-55°C到150°C，极大地增强了其在各种环境中的应用范围，包括严苛的工业环境和高温应用场合。
小型封装: 采用SOT-23封装，使得这一MOSFET非常适合现代紧凑型电子设备的需求，具备较小的占用空间和良好的焊接性，非常适合表面贴装（SMT）技术。
应用场景
ZVN3306FTA可广泛应用于多种电子设计中，具体应用场景包括但不限于：
- 开关电源: 由于其低导通电阻和高电压耐受能力，适合用于DC-DC转换器和其他电源管理系统。
- LED驱动: 在LED驱动电路中可用作切换元件，提供高效的电源供应。
- 信号开关: 作为低功耗信号开关使用，能够实现更快的开关响应和控制。
- 电机控制: 用于小型电机驱动电路中，控制电机的启停和速度调节。
总结
ZVN3306FTA是一款综合性能卓越的N沟道MOSFET，凭借其高压性能、低导通电阻和宽工作温度范围，成为了众多电子应用中的理想选择。无论是用于开关电源、LED控制，还是其他中小功率的电气控制，ZVN3306FTA都能够提供稳定、高效的工作性能，是设计师在寻找充满活力的解决方案时的有力工具。随着电子设备向着更高效率和更小尺寸的发展趋势，ZVN3306FTA无疑将在市场中继续发挥其重要作用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
