Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES DMP22D5UFO-7B DMP22D5UFO
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIODES DMP22D5UFO-7B
- Type
- X2-DFN0604-3
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- DMP22D5UFO-7B
- Electronic Component
- 1
- Package
- X2-DFN0604-3
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM0084328126
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 770mW
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 17pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DMP22D5UFO-7B 产品概述
DMP22D5UFO-7B 是由 DIODES 制造的一款高性能 P沟道金属氧化物半导体场效应管（MOSFET）。该器件的设计旨在满足不同电子应用中的需求，具有出色的开关性能和热稳定性，广泛应用于电源管理、负载开关和其他高效能的电路设计中。
设备特性
电源特性：DMP22D5UFO-7B 的额定功率为340mW，能够承受最大的电压为20V，电流为530mA。这些参数使得该 MOSFET 特别适用于较小电源应用以及要求低至中等电流的场合。
封装信息：该器件采用 X2-DFN0604-3 的封装形式，具有紧凑的尺寸和良好的散热性能，这使得 DMP22D5UFO-7B 能够方便地集成到现代小型电子设备中。DFN（双面无引脚芯片封装）的设计进一步减少了占用的板面空间，增强了布局的灵活性。
结构特点：作为 P沟道 MOSFET，DMP22D5UFO-7B 提供了较高的输入阻抗和低的导通电阻，这意味着在工作时可以获得更好的效率，减少了功率损耗。这是现代电子设备设计中至关重要的考虑因素，尤其在电池供电的设备中更为显著。
应用领域
DMP22D5UFO-7B 的用途广泛，涵盖多个领域，主要包括以下几个方面：
电源管理：它可以用于 DC-DC 转换器、电源开关和电源分配网络，提供对负载的有效控制。
负载开关：利用其高效率和低导通电阻特性，DMP22D5UFO-7B 可以用作负载开关，控制外部设备的启用与禁用，极大提高系统的能效。
信号开关：该 MOSFET 在信号处理电路中也有广泛的应用，适合用于一些微控制器或数字电路中信号路径的选择。
电池操作设备：由于其低功耗特性，DMP22D5UFO-7B 特别适合用于便携式设备以及其他需要节能设计产品中，帮助延长设备的电池使用寿命。
竞争优势
DMP22D5UFO-7B 凭借其卓越的性能和高可靠性，成为市场上众多 MOSFET 选择中的一种优势选择。它的设计考虑到性能和尺寸之间的平衡，使得设计师可以在节省空间的同时，确保电路的高效能。此外，由于 DIODES 在半导体行业的良好声誉和技术积累，DMP22D5UFO-7B 也可依赖于高品质的生产标准与支持。
结论
综上所述，DMP22D5UFO-7B 是一款多用途的 P沟道 MOSFET，凭借其优异的性能参数和紧凑的封装设计，适合多种电源管理及负载开关应用。通过采用这一器件，电子设计师可以在提高系统效率、减小产品体积和延长电池使用寿命之间找到理想的平衡点。随着电子行业持续发展，DMP22D5UFO-7B 将在创新技术和产品设计中扮演不可或缺的角色。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset for ATMEGA128-16AC
- Model
- ATMEGA128-16AC
- Package
- QFP-64
