WMSIC Electronic Components

DIODES FZT605TA

ModelFZT605TA
PackageSOT-223
BrandDIODES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
DIODES FZT605TA
Type
DIODES
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
DIODES
Electronic Component
FZT605TA
Electronic Component
1
Package
SOT-223
Type
NPN
Electronic Component
Darlington Transistor
Electronic Component
0.232g
Electronic Component
1
Electronic Component
BM0000280951
Operating Temperature
55℃~+150℃@(Tj)
Frequency(f T)
150MHz
Power Dissipation(Pd)
2W
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FZT605TA 产品概述

一、基本介绍

FZT605TA 是一款高性能的 NPN 达林顿型晶体管,广泛应用于开关电源、音频放大、驱动电机以及其他需要高增益的电子电路中。该晶体管提供卓越的电流增益和高电压承受能力,能够在多种工业和商业应用中发挥重要作用。在频繁变化的现代电子技术环境下,FZT605TA 凭借其优异的性能,成为设计师和工程师的理想选择。

二、关键参数

  1. 额定功率:FZT605TA 的额定功率为 2W,这使其在大部分中小功率应用中表现出色,适合驱动电流为 1.5A 的负载。

  2. 集电极电流 (Ic):该晶体管的最大集电极电流为 1.5A,意味着它能够轻松驱动常见的负载,提供稳定的性能。

  3. 集射极击穿电压 (Vce):其最大集射极击穿电压为 120V,确保了在高电压环境下的可靠运作,极大地扩展了其适用范围。

  4. 饱和压降 (Vce(sat)):在不同的集电极电流 (Ic) 和基础电流 (Ib) 情况下,FZT605TA 的饱和压降可达 1.5V,这使其在开关频率较高的应用中具备良好性能。

  5. 最大集电极截止电流:在特定条件下,其集电极截止电流最大值为 10µA,表现出色的关断特性。

  6. 直流电流增益 (hFE):在 5V 时,1A 的工作条件下,FZT605TA 的 DC 电流增益最小值为 2000,展现了几乎超乎寻常的增益特性,使其在驱动负载时能够保持较高的效率。

  7. 频率响应:FZT605TA 的跃迁频率为 150MHz,适合高频率应用,为信号放大和处理提供了额外的支持。

  8. 工作温度范围:其工作温度范围为 -55°C 至 150°C (Tj),适合各种恶劣环境应用,确保了组件的可靠性和耐用性。

三、封装与安装

FZT605TA 采用 SOT-223 封装,体积小巧,易于表面贴装。该封装类型在现代电子组件中的广泛应用可有效提高电路的性能,同时降低电路的整体尺寸及重量。

四、应用领域

因其出色的电流增益及抗压能力,FZT605TA 可广泛应用于以下领域:

  1. 电源管理:用于开关电源、DC-DC 转换器和电池管理系统中,提供高效驱动。
  2. 音频设备:可用于音频放大器,提升音频信号的强度,确保清晰的音质输出。
  3. 电机驱动:适合用于小型电机和智能家居设备中,实现高效电机控制。
  4. 传感器与信号放大:用于从传感器获取信号时,可以有效放大微弱信号。

五、总结

FZT605TA 是一款在性能上卓越且可靠的 NPN 达林顿型晶体管,其高集电极电流、优秀的电流增益以及宽广的工作温度范围,适应了各种现代电子应用的需求。无论是用于工业自动化、消费电子还是其他高要求的应用场景,FZT605TA 都能够满足严苛的性能标准,为设计师提供灵活的设计选择。此外,SOT-223 封装的设计使其易于集成和生产,进一步增强了其市场竞争力。因此,FZT605TA 是电子工程师选用可靠元件时值得考虑的重要选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.