WMSIC Electronic Components

DIODES AH1389-HK4-7 AH1389

ModelAH1389-HK4-7
PackageXFDFN-4-EP(1.1x1.4)
BrandDIODES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DIODES AH1389-HK4-7
Type
DIODES
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DIODES
Electronic Component
AH1389-HK4-7
Electronic Component
1
Package
XFDFN-4-EP(1.1x1.4)
Type
Electronic Component
Electronic Component
Hall Switch
Electronic Component
0.1g
Electronic Component
1
Features
Built-in Flip-Flop
Electronic Component
BM0227150998
Operating Temperature
40℃~+85℃
Operating Voltage
1.6V~3.6V
Operating Current
4uA
(Gs)
25mT
(Gs)
2mT;2mT

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AH1389-HK4-7 产品概述

一、产品简介

AH1389-HK4-7 是 DIODES(美台)推出的一款线性霍尔传感器,封装为 XFDFN-4-EP(1.1 × 1.4 mm),体积极小、功耗极低,适合空间受限的便携与电池供电应用。器件为单极型(unipolar)线性输出类型,可对外加磁场产生与磁密成比例的模拟响应,用于精确位置与磁场测量。

二、主要参数

  • 工作电压:1.6 V ~ 3.6 V
  • 工作电流:典型 4 µA(低功耗特性)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 工作点(Gs):-25 mT(用户给定)
  • 释放点(Gs):-2 mT;2 mT(用户给定)
  • 类型:单极型(对单一极性磁场敏感)
  • 封装:XFDFN-4-EP(1.1 × 1.4 mm)

(以上参数以用户提供为准,具体时序/典型曲线建议参考厂商数据手册。)

三、主要特性与优势

  • 极低功耗:4 µA 等级,适合长时间电池供电场景。
  • 宽电压范围:1.6–3.6 V,可兼容常见单节锂电或 1.8/3.3 V 系统。
  • 宽温度范围:工业级温度范围覆盖常见工作环境。
  • 小型封装:XFDFN-4-EP 有利于高密度 PCB 布局与小型化产品设计。
  • 单极响应:便于与定向磁铁配合,减小误触发概率。

四、典型应用

  • 旋钮/滑轨/位置检测(线性位移测量)
  • 微型开关与盖磁检测(单极接近检测)
  • 电池供电便携设备的低功耗磁场监测
  • 小型电机位置与转速检测、编码器辅助传感
  • 消费类、工业类位置与接近传感方案

五、封装与电路连接建议

  • 裸露热端(EP)建议焊接到地平面以改善散热与电气性能,且有利于 EMI 管理。
  • 电源端附近放置 0.1 µF 陶瓷去耦电容,靠近 VCC 与 GND 引脚焊盘。
  • 输出为模拟/线性信号时,若后端 ADC 精度敏感,建议在 PCB 上加入低噪放大或滤波网络。
  • 注意磁铁极性与传感面方向,单极器件需配合指定极向的磁体才能可靠动作。

六、设计与使用注意事项

  • 请以厂商数据手册为准,尤其是工作点、迟滞与温漂等典型曲线;用户提供的工作点/释放点应与样片实测对比确认。
  • PCB 布局注意将敏感信号线远离大电流回路和开关噪声源,必要时考虑差分或屏蔽措施。
  • 处理与装配时注意 ESD 防护,XFDFN 小封装在回流焊工艺中需控制温度曲线以防封装损伤。
  • 若用于安全或关键控制场合,建议加入自检与冗余设计以提高可靠性。

若需要,我可以根据您的具体电路与磁体规格,给出参考原理图、PCB 布局要点和磁体选型建议。

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