Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES DLLFSD01LP3-7 DLLFSD01LP3
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- DIODES DLLFSD01LP3-7
- Type
- DIODES
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- DLLFSD01LP3-7
- Electronic Component
- 1
- Package
- DFN-2(0.3x0.6)
- Electronic Component
- Switch Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0262574000
- Current
- 100mA
- Diode
- Electronic Component
- Current(Ir)
- 200nA@80V
- (Vf)
- 1.2V@100mA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 65℃~+150℃@(Tj)
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述: DLLFSD01LP3-7
1. 引言
DLLFSD01LP3-7 是一款高性能开关二极管，属于标准类型二极管，其设计专为在多种应用场景中提供可靠的整流和开关功能而开发。该产品由DIODES（美台）公司提供，广泛应用于电子电路中，尤其是在需要高速度及高效率的场合。其独特的规格使其成为设计师在开发生产电路时的重要选择。
2. 基础参数
- 电压 - DC 反向 (Vr)（最大值）: 80V
- 电流 - 平均整流 (Io): 100mA
- 正向电压 (Vf): 1.2V @ 100mA
- 反向恢复时间 (trr): 4ns
- 反向泄漏电流: 200nA @ 80V
- 电容: 2.5pF @ 0V, 1MHz
- 速度: 小信号≤200mA（Io），任意速度
3. 设计与封装
DLLFSD01LP3-7采用表面贴装型（SMD）封装，符合X3-DFN0603-2的标准，尺寸仅为0.3x0.6mm。这种微型封装设计不仅能有效节省空间，还便于自动化生产，从而提高整体生产效率。同时，它的封装类型使其能够在现代小型化设备中得到广泛应用。
4. 操作温度
该二极管的结温工作范围在-65°C至150°C之间，适应了极端工作环境的需求，使其在汽车电子、工业控制以及消费电子等多种领域中表现出色。经过验证的耐高温性能保证了其在高热环境中持续稳定的工作。
5. 应用领域
DLLFSD01LP3-7的应用领域非常广泛，主要包括：
- 开关电源：由于其较低的正向压降和快速的反向恢复时间，该二极管在开关电源中表现出色，可显著提高转化效率。
- 信号整流：它的高反向耐压能力和低反向泄漏电流，使其成为理想的信号整流器。
- 高频应用：快速的反向恢复时间便于在高频信号应用中进行有效的信号整流和开关，适用于RF和高速数据通信线路。
- LED驱动电路：在LED灯具和照明系统中，DLLFSD01LP3-7二极管可以确保快速响应，提供稳定的电流通路。
- 电动工具和家用电器：对于多种电动工具和家用电器，该元件可提供必要的保护和高效的电源管理。
6. 性能优势
经过严格的测试和验证，DLLFSD01LP3-7展现出优越的性能特点。其在电流负载下的低正向压降可使系统在效率方面得到提升，反向恢复时间的短暂特性可以减少开关损耗，确保设备快速反应。同时，其低反向泄漏特性有助于提高电路的整体可靠性。
7. 总结
DLLFSD01LP3-7是一款高度可靠且高效的开关二极管，尤其适合于需要小型化和高性能的电子应用。凭借其卓越的电气特性和广泛的工作温度范围，该产品不仅为设计师提供了灵活的设计空间，还有助于提高最终产品的市场竞争力。DIODES（美台）凭借在半导体领域的深厚实力，确保了DLLFSD01LP3-7在性能和质量上的领先地位，成为现代电子设计中不可或缺的优质元器件选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
