Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIODES B350AF-13 B350AF
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIODES B350AF-13
- Type
- DIODES
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIODES
- Electronic Component
- B350AF-13
- Electronic Component
- 1
- Package
- DO-214AD
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.047g
- Electronic Component
- 1
- Electronic Component
- BM0127477515
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 200uA@50V
- (Vf)
- 650mV@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B350AF-13 产品概述
基本信息
B350AF-13是一款高性能的肖特基二极管，专为要求高效整流和快速开关特性的应用而设计。此二极管的主要技术规格包括最大直流反向电压（Vr）为50V，平均整流电流（Io）达到3A，正向电压（Vf）在3A时为650mV，这使其在功率损耗方面表现出色。由于其低正向电压特性，B350AF-13适合在低电压、高电流的环境中使用，能够有效降低系统的发热量和能量损失。
主要特性
二极管类型：作为一款肖特基二极管，B350AF-13在开关速度、正向压降和反向恢复特性方面都展现出优异的性能。其快速恢复时间小于500ns，使其在高速开关应用中表现特出，能够有效提高电路的开关效率。
电压和电流承受能力：B350AF-13最大反向电压为50V，具备良好的电压支撑能力，适用于多种电压等级的电源电路。同时，其平均整流电流为3A，适合高功率应用的需求。
反向泄漏电流：在最大反向电压50V时，其反向泄漏电流仅为200µA，这一特性进一步降低了功耗，使其在待机或关断状态下能更为节能。
电容特性：B350AF-13在4V、1MHz时的电容为110pF，尤其适用于高频应用，可有效减小输入输出的干扰和噪声。
工作温度范围：该二极管具有宽广的工作温度范围，结温可在-55°C至150°C之间运行，适合各种工作环境的使用需求，包括高温和低温条件下的可靠性测试。
应用领域
B350AF-13广泛应用于以下几大领域：
- 开关电源：在开关电源电路中，B350AF-13的快速开关特性和低正向电压可用于提升整体能效，降低能量损失。
- 电池充电器：其反向泄漏电流小的特性，使得此二极管非常适合电池充电器设计，能够提高充电效率。
- 电机驱动器和逆变器：在逆变器和电机驱动应用中，B350AF-13能够有效减少功率损耗，提高驱动效率。
- 高频电路：由于其较低的电容值，适合在高频应用场合，比如RF 放大器和信号调理电路中使用。
封装和安装细节
B350AF-13采用表面贴装型封装（SMAF），使其在PCB布局中占用更少的空间。这种封装不仅适应现代电子产品对小型化的需求，也提供了良好的散热性能，能够更有效地应对应用中的热量问题。
结论
B350AF-13是一款性能卓越的肖特基二极管，其快速恢复特性、低正向电压和宽广的工作温度范围使其在各种高效能电路中均能发挥出色的作用。无论是在开关电源、充电器、还是电机驱动器等应用中，B350AF-13都能有效提升整体系统的性能，确保电路在高负荷条件下的可靠运行，是理想的选择。选择B350AF-13，您将体验到更高效、更环保的电源管理解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
