WMSIC Electronic Components

DIODES DXT2011P5-13 DXT2011P5

ModelDXT2011P5-13
PackagePowerDI-5
BrandDIODES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
DIODES DXT2011P5-13
Type
DIODES
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
DIODES
Electronic Component
DXT2011P5-13
Electronic Component
1
Package
PowerDI-5
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.22g
Electronic Component
1
Electronic Component
BM0229465192
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
130MHz
Power Dissipation(Pd)
3.2W
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DXT2011P5-13 产品概述

一、主要特性

DXT2011P5-13 是 DIODES(美台)推出的一款功率型 NPN 双极晶体管,面向开关与功率放大应用。器件具备高电压耐受能力和较大的集电极电流能力,具有低饱和压和较高的特征频率,适合要求效率和开关速度兼顾的场合。典型优势包括:100V 集电极-射极击穿、6A 连续集电极电流、低 VCE(sat)(典型 125mV,测量条件见下),以及 130MHz 的 fT。

二、关键参数

  • 晶体管类型:NPN,单只器件。
  • 集电极-射极击穿电压 VCEo:100 V。
  • 最大集电极电流 Ic:6 A(持续)。
  • 直流电流增益 hFE:30 @ Ic=2A、VCE=2V(工作点参考)。
  • 集电极截止电流 Icbo:500 nA(低泄漏)。
  • 射基极击穿电压 Vebo:7 V(请勿反向过压基极-射极)。
  • 集电极-射极饱和电压 VCE(sat):典型 125 mV(测量条件:IC=2A,IB=100mA)。
  • 特征频率 fT:130 MHz,利于中高频开关与放大。
  • 耗散功率 Pd:3.2 W(热设计需参考封装与 PCB 散热能力)。
  • 工作温度范围:-55 ℃ 至 +150 ℃。
  • 封装:PowerDI-5,便于 PCB 安装并兼顾热性能。

三、封装与热管理

PowerDI-5 封装在体积和散热能力之间做了平衡,适合表面贴装工艺。器件 Pd 为 3.2W,实际可用耗散与 PCB 铜箔面积、散热层以及环境温度密切相关。建议在大电流或连续导通场合增大底层散热铜箔面积,并考虑将集电极焊盘与散热层通过过孔连接到散热层,以降低结-环境热阻并保证可靠运行。

四、典型应用

  • DC-DC 转换器的开关管或同步整流。
  • 低压差功率放大器与线性调节器。
  • 电机驱动与功率开关(中小功率)。
  • 宽带放大及中频开关应用(受益于 130 MHz fT)。
    低 VCE(sat) 在高电流开关时可显著降低导通损耗,但需配合适当基极驱动以进入充分饱和。

五、设计与使用建议

  • 基极驱动:在放大区工作时,可按 hFE 约 30 的典型值估算基极电流(例如 2A 时 Ib ≈ 67mA)。如要求饱和,建议采用更大的强迫 β(Ib ≈ Ic/10…Ic/20),并验证 VCE(sat) 与开关损耗是否满足系统要求。
  • 保护与稳固:注意基-射极反向击穿 Vebo=7V,避免反向电压超过该值。系统应有过流、过温保护和合适的基极限流措施。
  • 热裕度验证:在目标环境温度和 PCB 实际布局下做热仿真或实测,确保结温在允许范围内并留有裕量。
  • 漏电管理:Icbo 典型为 500 nA,但在高温下仍会上升,敏感应用需注意待机漏电。

六、结论

DXT2011P5-13 为一款性能均衡的 NPN 功率晶体管,兼顾高电压耐受、较大电流能力与低饱和压,适合多种开关与放大场合。在实际设计中应重视基极驱动与 PCB 散热布局,以发挥其低损耗和中高频特性。若需精确的 SOA、热阻及脉冲特性,请参阅厂商正式数据手册并按应用条件做进一步评估与测试。

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