WMSIC Electronic Components

DIODES ZXMP6A17KTC

ModelZXMP6A17KTC
PackageTO-252
BrandDIODES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
DIODES ZXMP6A17KTC
Type
DIODES
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
DIODES
Electronic Component
ZXMP6A17KTC
Electronic Component
1
Package
TO-252
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.362g
Electronic Component
1
Electronic Component
BM0000287559
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.11W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ZXMP6A17KTC P沟道MOSFET

1. 概述

ZXMP6A17KTC是一款高性能的P沟道MOSFET,专为各种电子应用而设计,具有卓越的电气性能和可靠性。该器件不仅能够在高温和极端条件下保持稳定的性能,而且在低电压驱动和高电流应用中表现出色。这款MOSFET适用于开关电源、电机驱动、负载开关以及其他需要快速开关和低功耗的应用。

2. 关键技术参数

  1. FET 类型:P沟道MOSFET
  2. 技术:金属氧化物半导体场效应晶体管(MOSFET),它采用了先进的半导体工艺,具有高导通性和低导通电阻。
  3. 漏源电压(Vdss):60V,提供良好的耐压能力,使其能够在多种工作条件下安全运行。
  4. 连续漏极电流(Id):在25°C环境温度下可达4.4A,适合高功率应用。
  5. 驱动电压:该器件的驱动电压范围为4.5V至10V,确保逻辑电路的兼容性和高效开关操作。
  6. 导通电阻:在2.3A和10V条件下,导通电阻的最大值为125毫欧,表现出优异的导通效率,降低了功耗和发热。
  7. 门槛电压 (Vgs(th)):最大值为1V@250µA,确保在低电压下即可启动。
  8. 栅极电荷 (Qg):在10V驱动下最大为17.7nC,表示该器件具有较低的驱动损耗,适合高速开关应用。
  9. 输入电容 (Ciss):最大为637pF@30V,降低了高频应用中的传输损耗。
  10. 功率耗散:该MOSFET的最大功率耗散为2.11W,适合需要较高功率处理的应用场景。
  11. 工作温度范围:-55°C至150°C,为器件在恶劣环境下的可靠性提供了保证。
  12. 封装:采用流行的TO-252(DPak)封装,适合表面贴装技术(SMT)设计,便于在自动化生产线上的组装。

3. 应用领域

ZXMP6A17KTC MOSFET广泛应用于以下领域:

  • 开关电源(SMPS):在开关电源设计中,该器件可作为开关元件以提高效率和降低损耗。
  • 电机控制:适用于低压和中等电流的电机驱动方案,确保平稳和高效的电机运行。
  • 负载开关:该MOSFET可以在较低的控制电压下开关较大的负载,是理想的负载开关选择。
  • LED驱动:由于其优良的导电能力和低电阻特性,ZXMP6A17KTC可用于高效LED驱动解决方案。
  • 电池管理系统(BMS):在电池管理方案中,MOSFET可以用于电池的充电和保护电路。

4. 结论

ZXMP6A17KTC P沟道MOSFET是一款兼具高压、高电流和低损耗的高性能半导体器件,凭借其卓越的电气特性和宽广的应用领域,成为现代电子设计中的理想选择。该器件不仅能够满足各种工业和消费电子产品对能效和性能的严格要求,还能够在环境温度和电气条件变化较大的情况下保持其可靠性。因此,无论是在新产品设计还是现有产品的升级中,ZXMP6A17KTC均是值得信赖的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.