WMSIC Electronic Components

DOWO RB521S30T1G

ModelRB521S30T1G
PackageSOD-523
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO RB521S30T1G
Type
DOWO
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
RB521S30T1G
Electronic Component
1
Package
SOD-523
Electronic Component
Schottky Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0228536753
Current
200mA
Current(Ir)
30uA@10V
(Vf)
500mV@200mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V
Surge Current (Ifsm)
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB521S30T1G 产品概述

一、产品简介

RB521S30T1G 是东沃(DOWO)推出的一款小功率肖特基势垒二极管,封装为 SOD-523(SC-79),专为体积受限且需低压降、快速整流的便携式和消费类电子设计而优化。主要电气参数包括:正向压降 Vf = 0.5V @ 200mA,直流反向耐压 Vr = 30V,最大整流电流 200mA,反向漏电流 Ir = 30µA @ 10V,非重复峰值浪涌电流 Ifsm = 1A。

二、主要特性

  • 低正向压降:在 200mA 工作点上 Vf 约 0.5V,降低功耗与发热,提升电源效率。
  • 低反向漏流:10V 时 Ir 典型值 30µA,适合电源管理与待机电流敏感场合。
  • 快速开关:肖特基结构天然无恢复延迟,适合高频整流与快速切换应用。
  • 极小封装:SOD-523 占板面积小,适用于空间受限的移动设备与小型模块。
  • 合理的浪涌能力:Ifsm 达 1A,可承受短时启动或浪涌脉冲。

三、典型应用场景

  • 便携式电源与充电器中的反向保护或整流。
  • DC-DC 降压/升压电源的输出整流与续流保护。
  • 电池管理与电源切换(OR-ing)电路,降低备用电源切换损耗。
  • 信号链中的钳位保护与低电压降整流场合。
  • 空间受限的消费类电子、可穿戴设备与物联网终端。

四、封装与热性能提示

SOD-523 为极小型表贴封装,适合高密度 PCB 布局。由于封装体积小,器件的散热能力有限,建议在连续靠近额定电流工作时注意热管理与良好的 PCB 散热设计(增加铜箔面积或热 vias)。遇到较大占空比或持续电流时,应进行必要的电流/温升评估并考虑并联或选用更大封装产品。

五、设计与使用建议

  • 在 200mA 附近工作时,关注 Vf 导致的功耗:P ≈ Vf × I。
  • 对于脉冲浪涌,应确保脉冲宽度与频率满足 Ifsm 规定的测试条件,否则需留有裕度。
  • 对敏感待机电流电路,注意反向漏流随温度升高而增加的特性,必要时在规格表查阅温度对 Ir 的影响曲线。
  • 焊接工艺建议遵循常见的回流温度曲线规范,避免超出封装允许的热应力范围。

六、可靠性与选型要点

该型号适合小电流、高频率、追求低压降与小尺寸的应用。若系统需要更高的反向耐压或持续电流能力,可考虑更高 Vr 或更大封装的肖特基件。选型时请参考完整数据手册以获取温度系数、极限参数和封装机械图。

如需样片、封装尺寸图或更详细的绝对最大额定值及温度特性曲线,请联系 DOWO(东沃)或其授权分销渠道索取 RB521S30T1G 的完整数据手册。

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