WMSIC Electronic Components

DOWO ST10100L

ModelST10100L
PackageTO-277B
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO ST10100L
Type
DOWO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
ST10100L
Electronic Component
1
Package
TO-277B
Electronic Component
Schottky Diode
Electronic Component
0.144g
Electronic Component
1
Electronic Component
BM0264548695
Current
10A
Diode
1
Current(Ir)
100uA@100V
(Vf)
700mV
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ST10100L — DOWO(东沃) 肖特基二极管产品概述

一、概述

ST10100L 是一款面向中高电流整流与开关电源应用的肖特基二极管,品牌为 DOWO(东沃),独立式 TO-277B 封装。该器件具有低正向压降(典型 Vf ≈ 700mV)、100V 的直流反向耐压和 10A 的额定整流电流,适合需要低损耗、高效率整流的工程场合。

二、主要参数

  • 器件型号:ST10100L
  • 封装:TO-277B(独立式)
  • 正向压降(Vf):约 700mV(典型值)
  • 直流反向耐压(Vr):100V
  • 额定整流电流:10A(DC)
  • 反向电流(Ir):100µA @ 100V(常温)
  • 非重复峰值浪涌电流(Ifsm):180A(单次浪涌)
  • 工作结温范围:-55℃ ~ +150℃

三、特点与优势

  • 低正向压降:Vf≈0.7V 在同电流条件下有效减少导通损耗,降低整流时的功耗和发热。
  • 高浪涌能力:Ifsm 180A,能承受启动或短时冲击电流。
  • 低反向恢复:作为肖特基二极管,反向恢复时间很短,适合高频整流与降噪电路,开关损耗小。
  • 宽温度范围:-55℃ 至 +150℃ 的结温范围满足工业级温度要求。
  • 工业级反向耐压 100V,适用于常见的中低压电源系统。

四、典型应用

  • 开关电源(SMPS)输出整流或回流二极管
  • 电池充电器与电源管理模块
  • 功率整流、反向极性保护、续流(freewheeling)二极管
  • 太阳能逆变器、工业电源与电机驱动等需要高效率整流的场合

五、热管理与可靠性

在 10A 连续整流情况下,器件功耗大致为 P = I × Vf ≈ 10A × 0.7V = 7W(忽略交流纹波与温度依赖),需要良好散热措施。建议:

  • 将 TO-277B 安装于合适的散热片或使用热沉胶/导热垫,确保结温不会长期接近上限。
  • 注意环境温度和空气流通,必要时进行热仿真或测量。
  • 反向漏电流随温度上升显著增加,高温下应考虑降额或选型裕量。

六、使用注意事项

  • 避免频繁承受超过 Ifsm 的浪涌电流;若有多次冲击场合,应选用更高浪涌规格或并联降流(并联需注意电流均流问题)。
  • 在高温环境下,Ir 会增大,可能影响待机损耗和热稳定性,设计时需考虑漏电随温度的变化。
  • 焊接时遵循封装的温度限制和推荐工艺,避免长时间高温焊接导致器件性能退化。
  • 对于高频开关场合,注意布线布局以降低寄生电感与电阻带来的额外应力。

七、封装与采购信息

  • 封装形式:TO-277B,便于通过孔固定并进行热沉连接。
  • 品牌:DOWO(东沃)。
  • 采购与替代:在选型时核对正向压降、耐压、连续电流与浪涌能力,若需更低 Vf 或更高 Vr/Ifsm,可比较其它肖特基或快速恢复整流器件。

总结:ST10100L 以其低正向压降、较高整流电流与可靠的浪涌能力,适合多数中功率整流与高频开关电源场景。合理的热设计与温度管理是保证长期可靠工作的关键。若需更详细的电气特性曲线、典型浪涌波形或封装尺寸图,请向供应商索取器件规格书(Datasheet)。

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