WMSIC Electronic Components

DOWO SP5100L

ModelSP5100L
PackageTO-277B
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SP5100L
Type
DOWO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SP5100L
Electronic Component
1
Package
TO-277B
Electronic Component
Schottky Diode
Electronic Component
0.168g
Electronic Component
1
Electronic Component
BM0264356188
Current
5A
Diode
1
Current(Ir)
200nA@100V
(Vf)
600mV
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP5100L 产品概述

一、产品简介

SP5100L 为 DOWO(东沃)出品的一款肖特基二极管,面向中功率整流与开关电源输入保护场景。器件为单只独立二极管结构,设计注重低正向压降与高耐压兼容,适合要求高速恢复与低损耗的电源与逆变应用。

二、主要参数

  • 型号:SP5100L
  • 器件类型:肖特基整流二极管(单只)
  • 标称正向压降 (Vf):600 mV(典型/标称值,实际随电流与温度变化)
  • 直流反向耐压 (Vr):100 V
  • 额定整流电流:5 A(连续)
  • 反向漏电流 (Ir):200 nA @ 100 V
  • 非重复峰值浪涌电流 (Ifsm):150 A(单次浪涌)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:TO-277B
  • 品牌:DOWO(东沃)

三、核心特性与优势

  • 低正向压降:600 mV 的标称正向压降有助于降低导通损耗,提高效率,尤其在中等电流整流时能显著降低功耗与发热。
  • 高耐压与低漏电:100 V 的反向耐压配合极小的反向电流(200 nA @100 V),适合对反向泄漏敏感的电源输入与保护电路。
  • 良好的冲击承受能力:150 A 的非重复峰值浪涌电流能够应对启动瞬态与浪涌负载,提升可靠性。
  • 宽工作温度:-55 ℃ 至 +150 ℃ 的结温范围满足严苛环境下的长期工作需求。

四、典型应用场景

  • 开关电源整流(输出/整流桥改良)
  • 输入反向保护与极性保护电路
  • 车载电源系统与照明驱动(需注意封装与热管理)
  • 电池管理与UPS/备用电源整流
  • 各类工业控制器与电源模块中需兼顾低压降与较高耐压的场合

五、封装与热管理

SP5100L 采用 TO-277B 封装,封装结构提供良好的散热路径与机械强度。建议在实际应用中配合散热片或良好的印制板(PCB)散热设计使用:

  • 在连续 5 A 负载下,应评估结到环境的热阻并保证结温不超过规格上限;
  • 必要时增加热垫或金属散热结构并优化铜箔面积与过孔数,以降低结温并提升长期可靠性。

六、使用建议与注意事项

  • 正向压降受电流与温度影响较大,设计时以厂方给定的测量条件为准,必要时通过实验测定典型 If 下的 Vf。
  • 对于持续大电流或长时间浪涌工况,应验证 Ifsm 与热性能是否满足系统要求,并考虑余量。
  • 封装安装时注意散热片接触面平整并采用合适的热界面材料,电气绝缘需求应根据系统安全等级处理。
  • 在高温或高电压环境下,建议进行长期老化与热循环测试以评估可靠性。

七、可靠性与环境适应性

SP5100L 的工作结温范围覆盖工业级要求,适应宽温度变化;低漏电流与高峰值冲击能力有助于提升系统抗扰动性。对于关键应用场景,推荐参考厂方完整数据手册并按实际应用条件做可靠性验证(如热循环、浪涌与长期负载测试)。

如需更详细的电气特性曲线、热阻参数或引脚与封装机械图,建议联系 DOWO(东沃)获取完整数据手册及评估报告。

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