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DOWO ESD5311N
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO ESD5311N
- Type
- DOWO
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- ESD5311N
- Electronic Component
- 1
- Package
- DFN1006-2L
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 1g
- Electronic Component
- 1
- Cj- Capacitor
- 0.3pF
- Electronic Component
- BM0257638267
- Operating Temperature
- 55℃~+125℃
- Voltage
- 22V
- Electronic Component
- IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 100nA
- Voltage(VBR)
- 9.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESD5311N 产品概述
一、产品简介
ESD5311N 是东沃（DOWO）推出的一款小尺寸瞬态过压保护器件，类型为 ESD 抑制二极管（ESD）。器件采用 DFN1006-2L 封装，专为对低电容要求、高可靠性的静电放电与浪涌保护场合设计，适合移动终端、接口保护和传感器线路等空间受限的应用。
二、主要技术参数
- 反向截止电压 (Vrwm)：5 V
- 击穿电压 (VBR)：9.5 V
- 钳位电压：22 V（典型）
- 峰值脉冲电流 (Ipp)：5 A @ 8/20 µs
- 峰值脉冲功率 (Ppp)：110 W @ 8/20 µs
- 反向电流 (Ir)：100 nA
- 结电容 (Cj)：0.3 pF（低电容，适合高速信号）
- 工作温度范围：-55 ℃ ~ +125 ℃
- 防护等级/标准：符合 IEC 61000-4-5（浪涌）和 IEC 61000-4-2（静电放电）
三、关键特性与优势
- 低结电容（0.3 pF）：对高速数据线、差分信号或敏感模拟输入几乎无影响，兼顾保护与信号完整性。
- 紧凑封装 DFN1006-2L：便于高密度 PCB 布局与便携设备使用。
- 良好的浪涌与 ESD 抗扰能力：支持 5 A 峰值脉冲电流与 110 W 峰值功率，能有效吸收 8/20 µs 类浪涌能量。
- 宽工作温度：适应工业级温度范围，提高系统可靠性。
- 极低漏电流（100 nA）：在待机与低功耗系统中对电流影响小。
四、典型应用场景
- 手机、平板、笔记本等移动终端的 I/O 接口保护（USB、耳机等）。
- 高速通信接口与射频前端的静电防护。
- 工业控制、传感器输入、ADC 前端等对信号完整性要求高的场合。
- 需要符合 IEC 61000 系列电磁兼容标准的设备端口保护。
五、封装与电路布局建议
- 建议贴近被保护引脚放置并尽量缩短走线，减小环路电感以提高吸收能力。
- 地线应采用低阻抗回流路径，必要时在器件附近增加地层过孔以增强散热与屏蔽。
- 对于差分或对称信号，注意对称布置以避免影响平衡特性。
六、可靠性与合规
ESD5311N 设计满足 IEC 61000-4-2（静电放电）和 IEC 61000-4-5（浪涌）规范，器件在-55 ℃ 到 +125 ℃ 的温度范围内可稳定工作，适合要求长期可靠性的消费与工业应用。
七、选型与注意事项
- 若待保护信号电压高于 Vrwm（5 V），需评估工作场景是否会触发持续导通或改用更高 Vrwm 的器件。
- 对高速差分接口确认结电容对信号带宽的影响，0.3 pF 适合大多数高速场合。
- 在高能量冲击场景下，核对 PCB 中的多点保护策略以分散能量，延长器件寿命。
八、总结
ESD5311N 以其低电容、紧凑封装与合规的浪涌/ESD 能力，为需要同时考虑信号完整性与端口保护的设计提供了平衡的解决方案。适用于移动设备、通信接口以及工业传感等多种场景，是对空间与性能有较高要求时的优选保护器件。
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