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DOWO CUS10S30
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO CUS10S30
- Type
- DOWO
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- CUS10S30
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0228536754
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1mA@30V
- (Vf)
- 875mV@3A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CUS10S30 产品概述
一、产品简介
CUS10S30 为 DOWO（东沃）品牌的小型整流二极管，采用 SOD-323 表面贴装封装，面向板级整流、极性保护与浪涌抑制等通用场合。器件的典型电气参数包括：正向压降 Vf=0.875V（@3A）、非重复峰值浪涌电流 Ifsm=9A、直流反向耐压 Vr=30V、反向电流 Ir=1mA（@30V），额定整流电流为 1A。
二、主要参数要点
- 正向压降：0.875V @ 3A（数据点，实际 1A 工作时可能更低，应参见完整 V–I 曲线）
- 平均整流电流：1A（板级连续整流能力）
- 非重复峰值浪涌：9A（短脉冲、一次性浪涌承受能力）
- 反向耐压：30V
- 反向泄漏电流：1mA @ 30V（较高，需注意高阻抗场合的泄漏影响）
- 封装：SOD-323（小体积，适合高密度贴片）
三、特性与适用性
CUS10S30 体积小、成本低，适合输出二次整流、板级单向保护与电流不大的开关电源辅助电路。器件具备一定的浪涌承受能力（Ifsm=9A），在有短时冲击的场合能提供保护。需注意其正向压降偏高（测试条件为 3A）和在高反向电压下反向电流较大，因此不适合对效率或漏电严格敏感的低功耗、高阻抗电路。
四、封装与热管理建议
SOD-323 为小封装，散热能力有限。按照给定 Vf，在 1A 导通时瞬时功耗约为 0.875W（Pf = Vf × If），连续工作时必须考虑 PCB 铜箔散热、焊盘面积与环境温升。推荐在布局时：
- 增大焊盘与接地铜箔以利散热；
- 避免长时间在高平均电流下连续工作；
- 对于频繁高电流脉冲，验证结温并参照厂家完整热阻数据进行热仿真。
五、设计与选型注意事项
- 若电路对漏电流敏感，应避免 30V 区域长期偏压或考虑选用低漏电型产品；
- 若追求低正向损耗，应选用 Vf 更低的肖特基器件或更大封装的整流器件；
- 在不确定应用（如高频整流、快恢复需求）时，建议获取完整数据表，确认反向恢复时间、结电容等参数；
- 选型时考虑器件的浪涌能力与板上热阻匹配实际使用的脉冲规范。
六、可靠性与测试建议
在产品验证阶段建议做温升测试、反向泄漏随温度与电压的测量、浪涌与重复脉冲寿命试验以及焊接可靠性试验。对长期可靠性有要求的设计，应进行在额定结温下的老化测试与热循环测试。
七、总结
CUS10S30 是一款用于常规板级整流与保护的经济型 SOD-323 封装二极管，适合对体积与成本敏感、且电流不大或偶有短时浪涌的场合。在实际设计中应关注其正向压降与反向泄漏特性，并做好 PCB 散热与测试验证。如需更精确的电气与热参数（如 Vf–If 曲线、热阻、反向恢复时间等），请参考厂方完整数据手册或联系 DOWO 获取最新资料。
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