WMSIC Electronic Components

DOWO 1N4004

Model1N4004
PackageSMA
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO 1N4004
Type
DOWO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
1N4004
Electronic Component
1
Package
SMA
Electronic Component
General Purpose Diode
Electronic Component
0.122g
Electronic Component
1
Electronic Component
BM0257638255
Current
1A
Diode
1
Current(Ir)
1uA
(Vf)
1.1V@1A
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N4004 通用整流二极管(DOWO 东沃,SMA封装)

一、产品简介

1N4004 是一款经典的通用整流二极管,DOWO(东沃)提供SMA贴片封装版本,适用于对空间、成本和可靠性有要求的SMT生产线。该器件面向一般直流整流、保护和开关电源的低频应用,结构简单、性能稳定、易于采购与替换。

二、主要参数

  • 二极管数量:1个独立式
  • 正向压降:Vf = 1.1V @ IF = 1A(典型值)
  • 直流反向耐压:Vr = 400V(可承受最高反向电压)
  • 连续整流电流:IF(AV) = 1A
  • 非重复峰值浪涌电流:Ifsm = 30A(单次8.3ms半波冲击)
  • 封装:SMA(表面贴装,适配SMT工艺)
  • 品牌:DOWO(东沃)

三、特性与优势

  • 可靠的反向耐压能力(400V),适合交流整流和高压直流链路。
  • 1A连续整流等级满足小功率电源、适配器和控制电路常见需求。
  • 峰值浪涌30A能承受开机或短时浪涌电流,增强抗冲击能力。
  • SMA封装节省PCB面积,适合自动贴装与回流焊工艺,便于量产。
  • 设计简单、成本低,兼容多数1N400x家族电路替换与升级。

四、典型应用场景

  • 低功率整流桥或单点整流(适配器、电源模块)
  • 输入防反接与极性保护电路
  • 开关电源中低频整流、续流二极管(注意频率与损耗)
  • LED驱动、电机驱动的小功率保护与整流
  • 消费电子、家电、小型工业控制设备

五、封装与安装建议

SMA为表面贴装封装,推荐使用标准SMT焊盘与回流焊工艺。焊接时注意:

  • 遵循厂商的回流温度曲线以避免热损伤;
  • 为维持良好散热性能,适当增大焊盘铜面以帮助散热;
  • 当电流接近1A连续工作时,应在PCB设计上提供足够的散热路径和铜箔面积。

六、热与电气注意事项

  • 虽为1A等级,连续工作电流与环境温度、PCB散热条件密切相关,必要时做降额设计;
  • 正向压降在高电流下会产生较大功耗(Pd ≈ Vf × IF),需计算结温并保证不超过器件额定温度;
  • 反向泄漏电流随温度上升显著增加,高温环境应谨慎评估;
  • 若电路存在高频反复开关或要求低正向压降,建议考虑肖特基或快恢复二极管替代。

七、订购与数据资料

订购时请确认完整型号与供应商批次,向DOWO/东沃索取最新数据手册以获取详细的电气特性、机械尺寸、回流曲线和可靠性测试数据。实际设计与验证应以厂商数据表为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.