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DOWO DB307S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO DB307S
- Type
- DOWO
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- DB307S
- Electronic Component
- 1
- Package
- DB-S
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.528g
- Electronic Component
- 1
- Electronic Component
- BM0258760027
- Current
- 3A
- Current(Ir)
- 10uA
- (Vf)
- 1.1V@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DB307S 产品概述
一、产品简介
DB307S 是 DOWO（东沃）出品的一款单相整流元件，封装为 DB-S 型，针对中等功率直流整流与高电压阻断场合设计。其主要电气参数包括：正向压降 Vf = 1.1V（@3A）、直流反向耐压 Vr = 1kV、连续整流电流 If(AV) = 3A、反向漏电流 Ir = 10µA、非重复峰值浪涌电流 Ifsm = 80A，工作结温范围 -55℃～+150℃。该器件适用于桥式整流、整流输出滤波和各种工业电源应用。
二、主要特性
- 高耐压：Vr = 1000V，适合高压整流场合。
- 适中电流能力：连续整流电流 3A，满足多数中小功率电源需求。
- 低正向压降：Vf = 1.1V（3A），减小整流损耗与发热。
- 低反向漏流：Ir = 10µA（常温），提高系统空载与反向隔离性能。
- 良好浪涌承受力：Ifsm = 80A，可应对启动瞬态和冲击电流。
- 宽工作温度：-55℃～+150℃，适应苛刻环境。
三、电气与热特性说明
- 正向损耗：在 3A 工作点，单只器件约产生 P = Vf × I ≈ 3.3W 的结点损耗，长期工作需考虑热管理。
- 热管理建议：在 PCB 设计时使用较大铜箔面积与过孔散热，必要时靠近散热片安装；考虑环境温度时对额定电流进行温度降额。
- 浪涌限制：Ifsm 为非重复峰值浪涌能力，设计时应避免频繁接近该峰值；可在输入端并联热敏电阻或浪涌限流器以抑制启动冲击。
四、典型应用场景
- 交流输入桥式整流（开关电源前端、线性电源）
- 工业电源与控制设备的高压整流
- 电池充电器与电源模块的输出整流
- HV 低电流整流场合与浪涌承受要求较高的电源系统
五、封装与机械安装
DB-S 封装便于 PCB 安装和与散热体接触。推荐在布板时：
- 为整流器件提供充足的铜面积和散热过孔。
- 确保焊盘尺寸与制造商推荐一致，便于散热与电气连接。
- 安装时注意极性标识，避免反接导致损坏。
六、使用建议与注意事项
- 选型余量：在实际设计中建议留出电压和电流裕量（例如 Vr 留有 >20% 余量，If 留有工作温升余量）。
- 并联使用需注意：若需并联以提高电流能力，应采取小阻值均流电阻或热匹配手段，避免单只过载。
- 耐热与焊接：遵循器件制造商的焊接温度与回流曲线，避免过热影响可靠性。
- 抗浪涌策略：对可能存在的重复浪涌场景采用软启动、限流或外部抑制器件保护。
七、选型小结
DB307S 以其 1kV 的高耐压与 3A 的连续整流能力，适合需要高电压阻断且功率中等的整流场合。正确的散热设计、合理的余量与必要的浪涌保护可显著提高整机可靠性。若需更高连续电流或更低正向压降，请在同类产品中比较 Vf、热阻与封装散热能力，或考虑并联与外部散热方案。
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