WMSIC Electronic Components

DOWO B16WS

ModelB16WS
PackageSOD-323
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO B16WS
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
B16WS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0249905774
Current
1A
Diode
1
Current(Ir)
100uA@60V
(Vf)
700mV@1A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B16WS 产品概述

一、概述

B16WS(品牌:DOWO/东沃)为小封装、高效率的整流二极管,常用于低压快恢复与电源整流场合。其主要电气参数为:正向压降 Vf = 700 mV @ 1 A,直流反向耐压 Vr = 60 V,额定整流电流 1 A,反向漏电流 Ir = 100 µA @ 60 V,非重复峰值浪涌电流 Ifsm = 10 A。封装类型为 SOD-323,适合体积受限的消费电子与通信设备。

二、主要特性

  • 低正向压降:700 mV @ 1 A,减少整流损耗,有利于提高效率并降低发热。
  • 60 V 反向耐压:适用于一般单节电池、USB 及中低压开关电源保护。
  • 较小的反向漏电流:100 µA @ 60 V,在多数低功耗场合可接受;需注意高温下漏电会上升。
  • 封装紧凑:SOD-323 适用于表贴自动贴装与小型化设计。
  • 短时抗浪涌能力:非重复峰值 10 A,可承受上电或短路瞬态浪涌。

三、典型应用

  • 开关电源次级整流(低功耗、小功率)
  • 充电器与手机、平板等便携设备的电源整流与反向保护
  • 二极管 ORing(电源自动切换)与反向保护电路
  • LED 驱动与小功率电机驱动回路的回流保护

四、热管理与设计注意事项

  • 封装 SOD-323 热阻较大,长期 1 A 工作时,正向压降带来的功耗约 0.7 W(P = Vf × I),需通过 PCB 铜箔散热与降额设计保证结温在允许范围内。
  • 在高温环境或持续大电流条件下建议降额使用或选择更大封装器件。
  • PCB 布局建议:引脚处增加散热铜箔,缩短电流回流路径,靠近热源处不要放置敏感元件。

五、可靠性与焊接

  • 支持常规回流焊工艺,焊接温度/时间以生产数据手册为准,避免长时间高温以防器件性能退化。
  • 储存和操作时注意防潮防静电,开封后若未及时使用应按湿敏等级处理。

六、选型与替代

  • 若需更低正向压降或更小反向漏电,可选择同类更高级别肖特基或更大功率封装型号。
  • 采购时请确认完整器件型号(B16WS)、封装(SOD-323)与供应商(DOWO/东沃),并核对生产批号与质量证书。

备注:以上参数基于器件典型规格;在具体设计中请以厂商的最新数据手册为准,必要时进行样品验证测试以确保系统可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.