WMSIC Electronic Components

DOWO BAT54SLT1G

ModelBAT54SLT1G
PackageSOT-23
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO BAT54SLT1G
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
BAT54SLT1G
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0228586616
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
1V@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54SLT1G 产品概述

一、产品简介

BAT54SLT1G(品牌:DOWO/东沃)为小功率肖特基整流二极管,采用SOT-23表面贴装封装,针对便携与空间受限的电路板设计。器件具有低正向压降和较小的反向泄漏电流,适合做高频整流、反向保护和快速切换应用。

二、主要参数

  • 正向压降 (Vf):1V @ 100mA
  • 整流电流:200mA(连续直流)
  • 非重复峰值浪涌电流 (Ifsm):600mA(单次冲击)
  • 直流反向耐压 (Vr):30V
  • 反向电流 (Ir):2µA @ 25V
  • 封装:SOT-23(小型三引脚封装)

三、典型特性与优势

  • 小尺寸、低占板面积:SOT-23 适合高密度贴片设计。
  • 开关速度快:肖特基结构使恢复时间极短,适合高频整流与开关电源。
  • 低反向泄漏(室温):25V 时反向电流仅约 2µA,有利于低功耗电路。
  • 良好浪涌承受力:600mA 单次浪涌能力,可应对短时冲击电流。

四、应用场景

  • 便携式设备电源反向保护与整流(如充电管理、背光供电)。
  • 开关电源的小功率输出整流或钳位。
  • 信号线或接口的极性保护与防反接。
  • 高频脉冲整流、混合信号模块中的钳位元件。

五、封装与安装注意

  • SOT-23 封装热阻相对较高,长时间接近额定整流电流时需注意热管理与板上散热路径(增加铜箔散热、避开热敏元件)。
  • 焊接建议遵循厂家回流曲线,避免超时高温导致焊点或器件损伤。
  • 推荐在 PCB 布局中为二极管引脚附近设计适量铜箔并避免在狭小间距内布置高发热元件。

六、可靠性与使用建议

  • 反向泄漏随温度上升显著增加,若工作环境温度高,应增加余量或选用更低泄漏型号。
  • 连续工作电流应低于额定 200mA,并考虑温升和热击穿风险;浪涌仅作为短时应急能力,不建议频繁触发。
  • 若电路存在高能瞬态或较长大电流通路,建议并联或选用功率更高的肖特基管以降低压降与热耗。

七、选型与采购建议

  • 本型号适合对体积与开关性能要求较高、功率要求中低的产品。若系统中有更高的平均电流或更低正向压降需求,可考虑更大功率的肖特基器件。
  • 采购时核对批次与封装标识,向供应商确认器件的回流焊温度极限与可靠性测试报告,以确保在实际工艺与环境下表现稳定。

如需在特定电路中替换或并联使用该器件,可提供电路拓扑与工作条件,我可进一步给出热设计与并联策略建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.