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SS310是东沃(DOWO) 推出的一款独立式肖特基整流二极管,核心规格为3A持续整流电流、100V直流反向耐压,主打低正向压降、高浪涌耐受、宽温工作三大特性,定位中低压大电流整流场景,兼顾效率与可靠性,适配消费电子、工业、车载等多领域需求。
SS310的参数针对实际应用优化,核心指标的实际价值如下:
在3A额定持续电流下,正向压降仅850mV,显著低于传统硅整流二极管(通常1V以上),直接带来两个核心优势:
在100V反向电压下,反向漏电流仅100μA,有效解决两个痛点:
SS310采用SMB封装(DO-214AA),属于标准贴片封装,具备以下实用优势:
封装尺寸紧凑(约2.3mm×3.5mm×1.5mm),仅为传统TO-220封装的1/5,可大幅节省PCB空间,适合高密度电源模块(如便携充电器、LED球泡灯)。
支持自动化贴装,生产效率比插件封装提升3倍以上;同时,封装引脚采用镀锡工艺,焊接可靠性高,可避免虚焊问题。
封装内部采用铜基材料,热阻低(约10℃/W),可快速将结温传递至PCB,保障3A持续电流下的热稳定性(结温可控制在120℃以内)。
东沃(DOWO)作为专注功率半导体的品牌,SS310的品质管控符合行业严苛标准:
SS310的特性使其适用于以下高频场景:
SS310肖特基二极管凭借低Vf、高电流、宽温、抗浪涌的综合优势,成为中低压大电流整流场景的高性价比选择。东沃的品质保障与SMB封装的灵活性,使其可广泛应用于多领域,满足客户对效率与可靠性的双重需求。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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