WMSIC Electronic Components

DOWO SS310

ModelSS310
PackageSMB
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SS310
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SS310
Electronic Component
1
Package
SMB
Electronic Component
Schottky Diode
Electronic Component
0.184g
Electronic Component
1
Electronic Component
BM0264548688
Current
3A
Diode
1
Current(Ir)
100uA
(Vf)
850mV@3A
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS310肖特基二极管产品概述

一、产品核心定位

SS310是东沃(DOWO) 推出的一款独立式肖特基整流二极管,核心规格为3A持续整流电流、100V直流反向耐压,主打低正向压降、高浪涌耐受、宽温工作三大特性,定位中低压大电流整流场景,兼顾效率与可靠性,适配消费电子、工业、车载等多领域需求。

二、关键电性能参数解析

SS310的参数针对实际应用优化,核心指标的实际价值如下:

2.1 低正向压降(Vf=850mV@3A)

在3A额定持续电流下,正向压降仅850mV,显著低于传统硅整流二极管(通常1V以上),直接带来两个核心优势:

  • 降低导通损耗:减少电源模块发热,无需额外加装大型散热片,节省成本与空间;
  • 提升转换效率:尤其适合便携设备、LED驱动等对功耗敏感的场景,可将电能转换效率提升5%~8%。

2.2 中低压耐压与大电流能力

  • 直流反向耐压(Vr):100V:覆盖12V/24V系统的二次整流需求(如电源适配器、车载充电),避免反向击穿风险;
  • 持续整流电流(If):3A:可稳定承载3A以内的连续负载,适配中小功率电源设计(如10W~30W电源模块)。

2.3 低反向漏电流(Ir=100μA@100V)

在100V反向电压下,反向漏电流仅100μA,有效解决两个痛点:

  • 减少反向功耗:避免待机状态下器件发热,延长电源寿命;
  • 提升高压可靠性:适配高压待机场景(如电源适配器空载时的高压阻断)。

2.4 宽温工作与浪涌耐受

  • 工作结温范围:-55℃~+175℃:覆盖工业级(-40℃+85℃)、车载级(-40℃+125℃)等恶劣环境,无需额外温控设计;
  • 非重复峰值浪涌电流(Ifsm):70A:可承受开机瞬间、负载突变等大电流冲击(如充电器插电时的浪涌),无需额外并联TVS管,简化电路。

三、封装与物理特性

SS310采用SMB封装(DO-214AA),属于标准贴片封装,具备以下实用优势:

3.1 小型化设计

封装尺寸紧凑(约2.3mm×3.5mm×1.5mm),仅为传统TO-220封装的1/5,可大幅节省PCB空间,适合高密度电源模块(如便携充电器、LED球泡灯)。

3.2 表面贴装适配

支持自动化贴装,生产效率比插件封装提升3倍以上;同时,封装引脚采用镀锡工艺,焊接可靠性高,可避免虚焊问题。

3.3 热传导优化

封装内部采用铜基材料,热阻低(约10℃/W),可快速将结温传递至PCB,保障3A持续电流下的热稳定性(结温可控制在120℃以内)。

四、品牌与品质保障

东沃(DOWO)作为专注功率半导体的品牌,SS310的品质管控符合行业严苛标准:

4.1 合规性认证

  • 符合RoHS无铅标准,满足欧盟环保要求,可直接应用于出口产品;
  • 通过UL、CE安全认证,适配全球市场(如北美、欧洲、东南亚)。

4.2 可靠性测试

  • 高温老化测试:175℃结温下持续工作1000小时,电性能无衰减;
  • 浪涌冲击测试:多次施加70A峰值浪涌,器件无失效;
  • 温度循环测试:-55℃~+175℃循环500次,参数变化率≤5%。

五、典型应用场景

SS310的特性使其适用于以下高频场景:

  1. 电源适配器:手机、笔记本、平板充电器的二次整流,低Vf降低发热,宽温适配不同环境;
  2. LED驱动电源:12V/24V LED灯带、面板灯的整流与续流,3A电流满足多灯珠串联需求;
  3. DC-DC转换器:降压/升压模块的续流二极管,低损耗提升转换效率(可达92%以上);
  4. 车载电子:车载充电器、行车记录仪的电源整流,宽温范围适应车内-40℃~+85℃温度变化;
  5. 小型开关电源:机顶盒、路由器的电源模块,浪涌耐受能力避免开机冲击损坏。

六、总结

SS310肖特基二极管凭借低Vf、高电流、宽温、抗浪涌的综合优势,成为中低压大电流整流场景的高性价比选择。东沃的品质保障与SMB封装的灵活性,使其可广泛应用于多领域,满足客户对效率与可靠性的双重需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.