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DOWO NSR0320MW2T1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO NSR0320MW2T1G
- Type
- DOWO
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- NSR0320MW2T1G
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0228536751
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1mA@30V
- (Vf)
- 750mV@3A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NSR0320MW2T1G 产品概述
一、产品简介
NSR0320MW2T1G（品牌：DOWO/东沃）为小尺寸表面贴装整流器，SOD-323封装。其主要电气参数为：正向压降 Vf = 750mV（@3.0A）、整流电流 IF(ave) = 1A、非重复峰值浪涌电流 Ifsm = 9A、额定直流反向耐压 Vr = 20V、反向电流 Ir = 1mA（测量条件 30V）。该器件适用于低压、小功率的整流与保护场合，兼顾较高的浪涌承受能力与小型化封装要求。
二、主要电参数解读
- 正向压降 750mV（3A）：在较大工作电流时会有明显功耗（P ≈ Vf×I），设计时需考虑电压降和发热对系统效率的影响。
- 整流电流 1A：适合持续工作电流在1A及以下的小功率应用。
- 峰值浪涌 9A（非重复）：具备较好的抗浪涌能力，可承受短时充电、电源启动或输入瞬态电流冲击。
- 反向耐压 20V：适用于低压电源轨或作反向保护元件，不适合高压工况。
- 反向电流 1mA@30V：在反向电压较高时泄漏电流偏大，设计时需注意在高温或较高反向偏压下的漏电影响。
三、优势与设计要点
- 小尺寸、低封装高度，适合集成度要求高的便携与移动设备。
- 峰值浪涌能力好，适合存在瞬态高电流的场合如电池接入、输入整流或短时反向冲击。
- 由于Vf在高电流下接近0.75V且封装热阻较大，长时间1A工作时应控制热源和环境温度，必要时采取散热或减载措施。
- 反向泄漏偏大时，若电路对待机电流敏感，应考虑并联低漏电元件或选用低Ir的替代型号。
四、封装与热管理
SOD-323为超小型贴片封装，便于密集贴装但热量通过PCB传导有限。推荐的做法包括：在PCB焊盘处增加铜箔面积或开设热过孔以改善散热；在布局上靠近热源时预留热管理空间；对长期1A以上或高环境温度使用场合应考虑降额以保证可靠性。
五、典型应用场景
- 低压整流与二极管保护（电源输入、USB/充电接口的反向保护）
- 电池管理与电源路径控制（便携设备、移动电源）
- 开关电源输出整流（小功率DC-DC后级）
- 浪涌承受场合的缓冲与保护元件
六、使用与采购建议
- 在实际设计前，请参考厂方完整数据手册以获取温度特性、最大结温、回流焊工艺参数和应力限制等详细信息。
- PCB布局时注意散热与焊盘设计，必要时选择更大封装或并联器件以降低结温。
- 对反向泄漏敏感的应用，应评估在最高工作电压与温度下的漏电影响，必要时选用低Ir型号。
- 采购时确认生产批次与质量认证，关注封装标识与出货形式（带卷/单件）以便SMT生产。
（以上信息基于提供的主要参数整理，具体电气、机械和可靠性数据应以东沃正式数据手册为准。）
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