WMSIC Electronic Components

DOWO BAT60B

ModelBAT60B
PackageSOD-323
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO BAT60B
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
BAT60B
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0264356192
Current
3A
Diode
Electronic Component
(Vf)
600mV@1000mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
10V
Surge Current (Ifsm)
5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT60B 产品概述

一、产品简介

BAT60B 是东沃(DOWO)推出的一款独立式高电流肖特基二极管,封装为 SOD-323。该器件以低正向压降和低电感为主要特点,适合在开关电源、升压转换、检测电路及整流场合中使用。器件针对低压大电流应用进行了优化,在 1A 工作点具有较低的 Vf,可降低功耗并提高转换效率。

二、主要电气参数

  • 二极管类型:肖特基整流二极管(独立式)
  • 正向电压 Vf:600 mV @ 1000 mA
  • 直流反向耐压 Vr:10 V
  • 典型整流电流(连续):3 A
  • 非重复峰值浪涌电流 Ifsm:5 A
  • 封装:SOD-323(表面贴装)
    这些参数表明器件适合在低压(≤10 V)系统中承担高达数安培的整流或开关任务,且在瞬态冲击下具有一定的浪涌承受能力。

三、特点与优势

  • 低正向压降:在 1A 工作点 Vf≈0.6V,可显著降低整流损耗和发热,提升系统效率,尤其适用于功率敏感的便携或电池供电设备。
  • 低电感、低电容:肖特基结构天然具有快速恢复特性和较低结电容,利于高频开关场合减少切换损失和电磁干扰。
  • 小型表贴封装:SOD-323 占板面积小、适合高密度设计,有利于节省 PCB 空间。
  • 适用范围广:既可作整流、续流二极管,也可用于电压检测、低压升压转换等场景。

四、典型应用

  • 开关电源(SMPS)输出整流或续流二极管;
  • 升压转换器(Boost)中的二极管环节,降低反向恢复损耗;
  • 电池供电设备的电源路径整流、反向保护与二极管 OR-ing;
  • 电压检测与限幅电路,作为快速响应的信号钳制元件;
  • 功率管理与便携设备中需兼顾体积与效率的场合。

五、设计与使用建议

  • 电流与散热:尽管器件标称整流电流可达 3A,但 SOD-323 为小型塑封表贴,持续大电流工作时封装散热能力有限。建议在高连续电流场合优化 PCB 散热(增加焊盘铜箔面积、在背面加铜层或使用散热过孔),并根据实际工作温升留有裕量。
  • 浪涌与保护:Ifsm=5A 表示器件能承受短时冲击电流,但应避免频繁或长时间的浪涌,通过限流器件或合适的软启动设计降低冲击频次。
  • 反向电压限制:器件反向耐压仅 10V,禁止在超过此电压的场合使用;在系统中如可能出现高电压尖峰,应配合抑制元件(如 TVS)或采用更高 Vr 的型号。
  • 布局注意事项:为发挥低电感优势,尽量缩短关键走线长度,增大焊盘和接地铜箔面积;在高频开关节点处,靠近肖特基器件布置走线以降低环路电感。
  • 温度与可靠性:工作环境温度升高会显著影响器件寿命与性能,设计时考虑最大结温并留有热裕度,必要时进行功耗与温升仿真验证。

六、封装与焊接工艺

  • 封装:SOD-323,适合自动贴装与回流焊流程。
  • 焊接建议:遵循常用的无铅回流温度曲线(参考制程规范),避免超出器件耐热极限。焊盘设计应符合厂商推荐的焊盘尺寸以保证焊接可靠性与散热。
  • 存储与防护:贴片器件应保持干燥包装状态,开盘后按回流次数和时间窗口使用,防止湿热造成焊接缺陷。

七、采购与标识

  • 品牌:DOWO(东沃)
  • 型号:BAT60B
  • 采购时注意核对封装(SOD-323)、规格参数(Vr、Vf、Io、Ifsm)与批次,必要时索取样片或数据手册进行验证。对于关键应用建议通过正规渠道采购并要求器件合格证与检验报告。

总结:BAT60B 是一款面向低压高电流应用的肖特基二极管,凭借低正向压降与低电感特点,在电源整流、升压转换与检测电路中具有良好表现。但由于小型封装的散热限制,实际使用时应重视 PCB 热设计和反向电压保护,以确保长期可靠运行。

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