WMSIC Electronic Components

DOWO SM340A

ModelSM340A
PackageSMA
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SM340A
Type
DOWO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SM340A
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.126g
Electronic Component
1
Electronic Component
BM0264866319
Current
3A
Diode
1
Current(Ir)
500uA@40V
(Vf)
550mV@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SM340A — 3A / 40V SMA 封装整流二极管产品概述

一、产品概述

SM340A 为 DOWO(东沃)出品的一款单管独立整流二极管,额定整流电流 3A,直流反向耐压 40V,采用 SMA 表面贴装封装。该器件设计用于低压电源整流、续流与反向保护等场景,兼顾高电流能力与紧凑封装,适合消费电子、电源适配器与工业控制等应用。

二、主要电气参数

  • 二极管配置:1 个独立式
  • 正向压降(Vf):0.55V @ 3A
  • 额定整流电流:3A(DC)
  • 直流反向耐压(Vr):40V
  • 反向电流(Ir):500μA @ 40V
  • 非重复峰值浪涌电流(Ifsm):70A
  • 结温范围(Tj):-55℃ ~ +150℃
  • 封装:SMA
  • 品牌:DOWO(东沃) 从典型指标看,3A 工作点下正向功耗约为 1.65W,意味着在高电流连续工作时需注意散热与 PCB 设计。

三、产品特性与优势

  • 低正向压降:0.55V@3A,有助于降低整流损耗和发热;
  • 高浪涌承受力:70A 的非重复峰值浪涌电流可承受启动或短时冲击电流;
  • 宽工作温度范围:-55℃ 至 +150℃,适应恶劣环境;
  • SMA 表面贴装:便于自动贴片与高密度 PCB 布局。

四、典型应用

  • 开关电源整流输出;
  • 电源适配器与充电器;
  • 二极管保护(反向保护、续流二极管);
  • 工业控制器、家电与消费电子中低压电源路径。

五、封装与热管理建议

SMA 为小型表面贴装封装,热阻相对较大。建议:

  • 在 PCB 设计中增大焊盘铜箔面积并提供散热过孔;
  • 对于长期 3A 工作或靠近最大额定功耗场合,考虑并联多颗或增加散热片/铜箔;
  • 注意正反向电流随温度上升而增加,保证工作环境温度与结温有足够裕量。

六、可靠性与使用注意

  • 反向漏电较大(500μA@40V),在对漏电流敏感的电路中需评估;
  • 浪涌规范为非重复峰值,避免重复性冲击超出规格;
  • 焊接时遵循元器件热应力限制,推荐符合厂商回流温度曲线以保证可靠性;
  • 在近最大电压或高温环境下,应进行实际电路级别验证与热仿真评估。

七、结论

SM340A 是一款面向中低压、需要较大整流电流的通用整流二极管,具备低压降、高浪涌能力与宽温度范围,适用于多种消费和工业电源场合。设计时应重视散热与反向漏电特性,根据实际工况进行器件选型与 PCB 热设计验证。若需进一步数据(如正向温度系数、反向恢复时间或详细热阻),建议向 DOWO 索取完整数据手册以完成电路级优化。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.