WMSIC Electronic Components

DOWO SP1545L-C SP1545L

ModelSP1545L-C
PackageTO-277B
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SP1545L-C
Type
DOWO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SP1545L-C
Electronic Component
1
Package
TO-277B
Electronic Component
Schottky Diode
Electronic Component
0.184g
Electronic Component
1
Electronic Component
BM0264254687
Current
15A
Diode
1
Current(Ir)
150uA@45V
(Vf)
520mV
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP1545L-C 产品概述

一、产品简介

SP1545L-C 是 DOWO(东沃)推出的一款高电流肖特基整流二极管,封装为 TO-277B。该器件以低正向压降和较小的反向恢复特性著称,适用于开关电源与整流应用,能在紧凑方案中提供高效的功率传输与热可靠性。

二、主要电气参数

  • 二极管类型:独立式肖特基二极管(单只)
  • 正向压降(Vf):约 520 mV(典型值,测试条件请参考详细数据表)
  • 直流反向耐压(Vr):45 V
  • 整流电流(Io/IF):15 A(连续)
  • 反向电流(Ir):150 μA @ 45 V(室温或标注测试温度)
  • 非重复峰值浪涌电流(Ifsm):300 A(单次冲击能力)
  • 工作结温范围:-55 ℃ ~ +150 ℃

三、热特性与可靠性

SP1545L-C 的工作结温范围宽,适应工业级温度环境。肖特基二极管的反向漏电流随温度升高显著增加,设计时需考虑环境温升与结温控制。TO-277B 封装便于与散热器或大面积铜箔直接耦合,以降低结到环境热阻并保证长期可靠性。建议在高功率工况下进行适当降额和散热设计。

四、典型应用场景

  • 开关电源(SMPS)输出整流
  • 同步整流替代件或回收二极管
  • DC-DC 转换器、降压(buck)和升压(boost)电路
  • 电池充电与电源管理线路
  • 逆变器、汽车电子与工业电源中的快速整流与钳位保护

五、封装与机械特性

  • 封装类型:TO-277B(适合机箱安装或与散热片螺栓固定)
  • 尺寸与引脚布局请参照制造商机械图纸,便于 PCB 与散热件设计。
  • 封装便于在高电流通路中实现低压降与良好热传导。

六、设计与使用建议

  • 低正向压降有助于提升效率,但在高温下反向漏流增加,须留足热裕量。
  • 布局建议:缩短高电流回路走线,增大铜箔面积并采用多颗焊盘/散热孔以降低接触热阻。
  • 浪涌保护:Ifsm 虽可承受短时浪涌,长期或重复浪涌应通过限流/熔断器等保护电路处理。
  • 若用于高频开关场合,注意与寄生参数与电容有关的电磁兼容(EMC)问题。

七、对比与选型建议

与普通硅整流二极管相比,肖特基二极管具有更低的正向压降与极快的恢复特性,适合效率与开关性能要求高的电源设计。但在高压或高温环境下,硅二极管的漏电流与耐压表现可能更优。选型时应在 Vf、Vr、Io 与漏电随温度变化等维度综合权衡。

八、存储与运输注意事项

  • 存放环境应干燥、避免高温与潮湿;长期储存请遵循厂家建议的储存条件。
  • 运输与焊接时注意避免机械应力与静电,焊接温度曲线应符合封装的耐焊接标准。

如需更详细的电气特性曲线、热阻参数或封装机械图,请参阅 DOWO 官方数据手册或联系供应商获取 SP1545L-C 的完整规格书。

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