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DOWO B5819WS
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO B5819WS
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- B5819WS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Electronic Component
- BM0249905775
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1mA@40V
- (Vf)
- 900mV@3A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B5819WS 产品概述
一、产品简介
B5819WS（品牌：DOWO/东沃）为小型肖特基整流二极管，封装为SOD-323，面向小信号整流与低电压功率传递场景。该器件具有较低的正向压降和一定的浪涌承受能力，适合空间受限的表贴电路中作为整流、反向保护与续流元件使用。
二、主要电气参数
- 正向压降（Vf）：900 mV @ 3.0 A（测量点说明：高电流条件下的正向压降特性）
- 直流反向耐压（Vr）：40 V
- 整流电流：1 A（连续）
- 反向电流（Ir）：1 mA @ 40 V（典型环境下的反向漏电）
- 非重复峰值浪涌电流（Ifsm）：9 A（单周期脉冲能力）
以上参数表明器件适用于低压（≤40 V）场合的中小电流整流与防反接保护。需注意正向压降在高电流下接近1 V，发热与功耗需在电路热设计中考虑。
三、封装与机械特性
- 封装：SOD-323（超小型表贴封装），适合高密度PCB布局。
- 引脚与焊接：建议按SOD-323标准焊盘设计并遵循回流焊工艺参数，避免过热。由于封装尺寸小，器件热阻较大，热量主要通过焊盘传导至PCB。
四、典型应用场景
- 开关电源或DC-DC模块中的次级整流（低功率场合）。
- 低压电源的反向保护（防止电池或电源反接）。
- 信号和功率混合电路的续流二极管/钳位用途。
- 便携设备、通信终端、消费电子的小功率整流场合。
五、选型与使用注意事项
- 连续电流：器件标称整流电流为1 A，应结合PCB散热能力和环境温度进行裕量设计，建议在高温或通风受限场合降额使用。
- 功耗与散热：在3 A短脉冲状态下Vf≈0.9 V，若被误用为连续3 A会产生较大功率损耗（P=I·V），需避免长期高电流。
- 反向漏电：Ir在40 V时可达1 mA，若应用对漏电敏感（如待机电流要求严格），需评估反向漏电对系统的影响或选用漏电更低的器件。
- 浪涌能力：Ifsm为9 A，适合短时浪涌冲击，但不等同于长期过载能力，设计时仍需考虑冲击频次与能量限制。
六、可靠性与焊接建议
- 建议遵循J-STD-020回流焊温度曲线进行焊接，避免超温导致封装和材料性能下降。
- 存储与搬运应注意防潮防静电（ESD），开封后若长期保存建议回潮烘烤处理。
- 在高温环境（如60°C以上）反向漏电与正向压降会变化，需在系统级进行温度特性验证。
七、替代与配套建议
- 若需更低反向漏电或更低正向压降，可考虑同类40 V、1 A等级的其它肖特基器件或更大封装以改善散热。
- 在PCB布局上，可配合较大铜箔散热区或热过孔提升散热能力；必要时并联多只器件或选用更高电流等级产品。
总结：B5819WS为一款面向小型表贴、低压整流与防反接保护应用的SOD-323肖特基二极管。选型时应重视连续电流、散热和反向漏电特性，以确保在目标应用中获得稳定可靠的性能。
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