WMSIC Electronic Components

DOWO SMBJ400CA

ModelSMBJ400CA
PackageSMB(DO-214AA)
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SMBJ400CA
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SMBJ400CA
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.215g
Electronic Component
1
Electronic Component
BM0264254684
Operating Temperature
55℃~+150℃
Voltage
648V
Current(Ir)
1uA
Voltage(VBR)
447V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ400CA 产品概述

一、主要特性

SMBJ400CA 是东沃(DOWO)推出的一款双向(Bi-directional)瞬态电压抑制二极管(TVS),采用玻璃钝化芯片工艺,针对高压瞬态浪涌保护设计。主要参数如下:

  • 反向截止电压 VRWM:400V(连续工作电压)
  • 击穿电压 VBR:447V(典型)
  • 钳位电压 Vc:648V(在峰值脉冲电流条件下)
  • 峰值脉冲电流 Ipp:930mA(对应 Ppp)
  • 峰值脉冲功率 Ppp:600W(波形 10/1000μs,重复率 0.01%)
  • 反向泄漏电流 Ir:1μA(典型)
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SMB (DO-214AA);符合 RoHS 标准

额外特性包括极快响应时间、低泄漏电流以及优良的钳位能力,适用于单向和双向保护需求(本型号为双向单元)。

二、典型应用场景

  • 工业高压直流母线、逆变器、变频器及电机驱动器的输入/输出浪涌保护
  • 三相/单相交流供电系统(保护整流桥及后级直流母线)
  • 光伏并网逆变器、储能系统的直流侧保护
  • 通信基站直流供电、配电箱、防雷及过压浪涌抑制
  • LED 大功率驱动、电梯、伺服及工业自动化设备的过压防护

三、选型与使用注意

  1. 电压匹配:VRWM=400V 表明器件可在不触发导通的情况下长期承受最多 400V 的连续工作电压。用于交流 220VAC(峰值约 311V)或高压直流母线(≤400V)场合时须考虑安全余量和系统波动。
  2. 单向 vs 双向:双向器件在正负反向均可钳位,适合交流系统或有极性反复变化的场合;直流系统若对反向导通有更高要求可考虑单向型。
  3. 能量与寿命:Ppp=600W(10/1000μs)为瞬态峰值能力,重复脉冲占空比受限(0.01%)。若系统存在重复或长时间能量注入(如频繁雷击、持续浪涌),应评估能量与器件热耗并采用多级保护或限流元件。
  4. 钳位电压:648V 的钳位电压为峰值钳位,选择时需确认被保护电路能承受该瞬态电压。必要时在前端加入阻抗或吸收级以降低钳位需求。

四、封装与安装建议

SMB(DO-214AA)封装适中,便于手工焊接与自动贴装。为了获得最佳浪涌散热与性能:

  • PCB 布局尽量缩短 TVS 到被保护线的导线长度,减小串联电感。
  • 封装底部及周边采用宽铜箔,并在背面增加散热过孔(via)导入内/底层散热平面。
  • 对于频繁冲击或高能量环境,考虑并联多个器件或串联与阻性元件分担能量。
  • 遵循制造商的回流焊温度曲线,以免影响玻璃钝化芯片可靠性。

五、可靠性与合规

玻璃钝化工艺提高了器件的稳定性和抗击穿能力,低泄漏和宽温度范围(-55℃~+150℃)适应严苛工业环境。产品符合 RoHS 要求,适用于需要环保合规的工程项目。

如需进一步的典型曲线(I-V 特性、钳位曲线、热阻等)、封装图纸或样片支持,请联系供应商或索取完整数据手册以进行电路级验证与可靠性评估。

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