WMSIC Electronic Components

DOWO PESD3V3U1UA

ModelPESD3V3U1UA
PackageSOD-323
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO PESD3V3U1UA
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
PESD3V3U1UA
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.026g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.8pF
Electronic Component
BM0264548670
Operating Temperature
40℃~+125℃
Voltage
16V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD3V3U1UA — DOWO(东沃) 3.3V 单向 ESD 保护二极管产品概述

一、产品简介

PESD3V3U1UA 是 DOWO(东沃)面向 3.3V 数字接口的单向瞬态电压抑制器(TVS/ESD)器件,采用 SOD-323 小封装,专为高速数据线与敏感电子端口提供瞬态过压和静电放电保护。器件在 8/20µs 浪涌条件下具备 20A 峰值脉冲电流(Ipp),钳位电压 16V,能够在苛刻电磁脉冲环境下有效保护下游电路。

二、主要规格与特点

  • 极性:单向
  • 反向截止电压 Vrwm:3.3V
  • 钳位电压 Vc(典型):16V(8/20µs 浪涌)
  • 峰值脉冲电流 Ipp:20A @ 8/20µs
  • 峰值脉冲功率 Ppp:350W @ 8/20µs
  • 反向漏电流 Ir:≤1µA
  • 结电容 Cj:0.8pF(低电容适合高频信号)
  • 通道数:单路
  • 工作温度:-40℃ ~ +125℃
  • 封装:SOD-323(小型贴片)
  • 防护等级:符合 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 标准
  • 类型:ESD/Surge 保护器件

三、应用场景

PESD3V3U1UA 适用于需要低电容和高可靠瞬态抑制的场合,典型应用包括:

  • MCU/FPGA 的 3.3V I/O 引脚与外设接口
  • USB、串口、I2C、SPI 等数据线的线路保护
  • 手机、物联网模块、消费类电子和工业控制端口的静电与浪涌防护
  • 边缘连接器、天线及外部接口处的防护元件

四、设计与布局建议

  • 尽量将器件靠近被保护的接口或连线放置,以缩短走线长度并降低寄生电感。
  • 地线应直接回到参考地(例如 PCB 接地平面),避免通过长回流路径。
  • 对高速信号线,可在器件和连接器之间加入小阻抗/共模滤波以改善抗扰度,但注意总线延迟与信号完整性。
  • 在高功率浪涌场合,配合合适的系列阻抗或熔断元件以分担能量,延长器件寿命。
  • 对焊盘和热设计进行合理安排,SOD-323 封装建议按照制造商给出的 PCB 焊盘尺寸以保证良好焊接与热散。

五、可靠性与包装

PESD3V3U1UA 工作温度范围宽,适应工业级环境。低漏电流与低结电容设计保证在不干扰正常信号的前提下提供高效保护。常规为卷盘(reel)封装,适合贴片生产线回流焊工艺;实际供货与包装详情可咨询 DOWO(东沃)或经销渠道。

总结:PESD3V3U1UA 以其低电容、低漏电、高峰值抑制能力和小型 SOD-323 封装,成为3.3V接口保护的实用选择。针对不同系统需求,结合合理的 PCB 布局和外围防护元件,可获得稳健的抗静电与抗浪涌性能。若需具体电气特性曲线、封装图或参考设计,请提供具体应用场景以便给出更详细的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.