WMSIC Electronic Components

DOWO SS220

ModelSS220
PackageDO-214AC(SMA)
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SS220
Type
DOWO
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SS220
Electronic Component
1
Package
DO-214AC(SMA)
Electronic Component
Schottky Diode
Electronic Component
0.209g
Electronic Component
1
Electronic Component
BM0228586611
Current
2A
Diode
Electronic Component
Current(Ir)
50uA@200V
(Vf)
920mV@2A
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS220 产品概述(DOWO 东沃)

一、产品简介

SS220 为 DOWO(东沃)品牌的独立式肖特基整流二极管,封装为 DO-214AC(SMA)。该器件针对中功率整流与开关电源应用设计,具有较低的正向压降与良好的浪涌承受能力,适用于各种工业与消费类电源场景。

二、主要电气参数

  • 二极管类型:肖特基(独立式、单管)
  • 正向压降(Vf):920 mV @ IF = 2 A
  • 直流反向耐压(Vr):200 V
  • 额定整流电流(IF):2 A(连续)
  • 反向漏电流(IR):50 μA @ VR = 200 V(常温)
  • 非重复峰值浪涌电流(Ifsm):50 A
  • 工作结温范围:-55 ℃ ~ +175 ℃
  • 封装:DO-214AC(SMA)

三、性能亮点与应用场景

  1. 低正向压降:在 2 A 工作点下 Vf ≈ 0.92 V,减小导通损耗,有利于提升效率并降低发热。
  2. 高反压能力:200 V 的反向耐压适用于较高母线电压的整流和保护电路。
  3. 浪涌能力强:50 A 的非重复峰值浪涌电流允许器件承受较大的启动或故障瞬态电流。
    典型应用包括开关电源整流、降压/升压转换器的续流二极管、逆接保护、汽车电源(适配高压母线时需注意温升)、太阳能逆变器与电池管理系统等。

四、热管理与封装注意

  • DO-214AC(SMA)为表面贴装封装,易于自动化生产。
  • 虽为中小功率器件,但在接近额定电流条件下仍需合理的 PCB 散热设计:增大焊盘铜箔面积、使用散热槽或下层过孔增强热传导。
  • 正确的回流焊工艺与温度曲线可保证焊接可靠性;避免超过器件最高结温与瞬态焊接温度限制。

五、可靠性与使用建议

  • 反向漏电流随温度上升显著增加,设计时应考虑在高温工况下的漏电与功耗。
  • 在重复或长时间的高浪涌场景(例如多次冷启动)应选用更高浪涌能力或并联降压措施。
  • 存储与搬运需防潮、防静电,避免机械应力导致封装与引脚损伤。

六、选型与采购提示

  • 型号:SS220,品牌:DOWO(东沃),封装:DO-214AC(SMA)。
  • 采购时确认测试条件(Vf 测试电流、Ir 测试电压与温度)与所需系统工况匹配,必要时向供应商索取完整数据手册与器件曲线(Vf‑IF、Ir‑VR‑T、功耗‑温升等)。

如需更详细的电气特性曲线、封装尺寸图或 PCB 推荐样式,可提供进一步资料以便针对具体应用做热仿真与选型优化。

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