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DOWO SP860L
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO SP860L
- Type
- DOWO
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- SP860L
- Electronic Component
- 1
- Package
- TO-277B
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.146g
- Electronic Component
- 1
- Electronic Component
- BM0264801965
- Current
- 8A
- Diode
- 1
- Current(Ir)
- 150uA@60V
- (Vf)
- 530mV
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SP860L 产品概述
一、产品简介
SP860L 为一颗独立式肖特基二极管，由 DOWO（东沃）出品，封装为 TO-277B。肖特基结构带来低正向压降与快速恢复特性，适合高效率电源和开关应用。该器件设计用于中等电流整流与冲击耐受场合，兼顾散热与抗浪涌能力。
二、主要参数与性能
- 正向压降 (Vf)：≈0.53 V（厂方标称值，实际 Vf 与测试电流和结温有关，请以样片数据为准）
- 直流反向耐压 (Vr)：60 V
- 连续整流电流：8 A
- 反向漏电流 (Ir)：150 μA @ 60 V（常温条件下测得）
- 非重复峰值浪涌电流 (Ifsm)：180 A
- 工作结温范围：-55 ℃ ~ +150 ℃
这些参数表明器件在常温下有较低的导通损耗与良好浪涌承受能力，但反向漏电随温度上升会增加，热管理需重视。
三、典型应用场景
- 开关电源输出整流（Synchronous 替代或混合场景）
- 续流/自由轮二极管（电感负载回路）
- 防反接保护与低压降电源路径
- 电池管理与充电器（需注意温升与漏电）
- 工业电源模块与功率整流单元
四、设计与热管理注意事项
- Vf 标称值通常在特定电流（如 4 A、8 A）下测得，设计时应按目标工作电流和最高结温计算功耗 P = Vf × I。
- TO-277B 封装需充分散热：建议配合散热片或把器件固定在具良好导热性的机械结构上，以保证长期 8 A 连续工作。
- 反向漏电随温度显著上升，高温环境下需考虑漏电对系统待机功耗和失效安全的影响。
- Ifsm 表示非重复峰值浪涌能力，适用于启动或短时冲击，但不宜作为连续过载依据。
五、封装与机械特性
TO-277B 提供便于装配的螺栓固定方式，利于与散热片直接接触并实现可靠热路径。实际安装时应注意绝缘需求和螺钉扭矩，避免应力集中或降额。
六、可靠性与环境适应
器件额定结温范围为 -55 ℃ ~ +150 ℃，适应较宽温度环境。长期可靠性受结温与循环温度影响，建议在高温、高应力场合进行加速寿命评估。
七、选型建议
在替代或比较时，关注三项关键指标：Vf（导通损耗）、Ir（漏电）与 Ifsm（浪涌能力），并结合封装热阻与实际散热方案进行整机级热仿真。若需满足更低 Vf 或更高 Vr/Ifsm，可在同类肖特基产品中对比 SPEC 表进行选择。
备注：以上为基于您提供参数的产品概述，建议在最终设计前查阅厂方完整 datasheet 并做样品验证，以确保关键工况下的性能与可靠性。
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