WMSIC Electronic Components

DOWO K26

ModelK26
PackageSOD-123
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO K26
Type
DOWO
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
K26
Electronic Component
1
Package
SOD-123
Electronic Component
Schottky Diode
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0231093700
Current
2A
Diode
Electronic Component
Current(Ir)
100uA@60V
(Vf)
700mV@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K26 肖特基二极管 产品概述

一、产品简介

K26 为 DOWO(东沃)出品的独立式肖特基整流二极管,采用 SOD-123 小封装,面向开关电源、DC-DC 转换、续流与整流等对低压降与高速整流有要求的电源应用。器件以低正向压降和快速响应为主要卖点,适合空间受限且需高效率的电路设计。

二、主要参数

  • 型号:K26
  • 封装:SOD-123(独立式)
  • 正向压降:Vf = 0.7 V @ IF = 2 A
  • 额定整流电流:IF = 2 A(直流)
  • 反向耐压:VR = 60 V
  • 反向电流:IR = 100 μA @ 60 V
  • 非重复峰值浪涌电流:IFSM = 40 A(单次脉冲)
  • 工作结温范围:-55 ℃ ~ +150 ℃

三、主要特点与优势

  • 低正向压降(0.7 V@2A),减少导通损耗,提高系统效率;
  • 肖特基结构,几乎无反向恢复,适合高频开关环境;
  • SOD-123 封装体积小,利于板面节约与自动贴装生产;
  • 较高的浪涌承受能力(40 A 单次),能应对短时冲击电流;
  • 宽温工作范围,适用于工业级环境。

四、典型应用场景

  • 开关电源输出整流(同步替代或辅助整流);
  • DC-DC 转换器、降压/升压模块;
  • 充电器与适配器的次级整流;
  • 反并联续流二极管、保护电路与抑止回灌。

五、设计与使用建议

  • 在 PCB 设计时为 SOD-123 提供适当的散热铜箔,若长时间 2 A 运行建议扩展焊盘以降低结壳热阻;
  • 若系统工作电压接近 60 V,应留有安全余量或选择更高 Vr 器件;
  • 注意反向漏电在高温或高压下会增加,需评估系统漏电流容限;
  • 浪涌(IFSM)为非重复值,频繁冲击需采用更高规格或并联设计并考虑电流分享问题;
  • 遵循封装的回流焊工艺温度限制及防静电、湿敏处理规范。

六、可靠性与采购说明

K26 适合要求低压降与高频整流的普通工业与消费电子应用。采购时请确认 DOWO(东沃)原厂或授权分销商的出货批次与质量文档(RoHS、SILK 标识、包装方式),并结合实际散热与寿命要求做必要的验证测试。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.