Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DOWO LMV358
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO LMV358
- Type
- DOWO
- Minimum package
- 4000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- LMV358
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.18g
- Electronic Component
- 1
- Electronic Component
- Output
- Features
- Built-in
- Electronic Component
- BM0230826978
- Operating Temperature
- 40℃~+85℃
- Amplifier
- 2
- Output Current
- 30mA
- (SR)
- 500V/ms
- Power Supply Voltage
- 2.1V~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMV358（DOWO 东沃）产品概述
一、简介
LMV358 是一款低功耗、双路运算放大器，具备轨到轨输入与轨到轨输出特性，适合低电压单电源系统和便携式电子设备。该器件在低静态电流与较好的共模抑制比下提供稳定的信号放大能力，特别适用于传感器信号调理、低频滤波与数据采集前端。
二、主要规格（概要）
- 放大器数：双路
- 单电源工作电压范围：2.1V ~ 5.5V（最大电源宽度 Vdd–Vss：7.5V）
- 轨到轨输入、轨到轨输出
- 共模抑制比 CMRR：70 dB
- 输入噪声密度 eN：27 nV/√Hz @ 1 kHz
- 增益带宽积 GBP：1.1 MHz
- 压摆率 SR：500 V/ms
- 输入失调电压 Vos：800 μV；温漂 Vos TC：2.7 μV/°C
- 输入偏置/失调电流 Ib / Ios：10 pA
- 静态电流 Iq：45 μA（每通道/典型）
- 输出电流：30 mA
- 工作温度范围：-40℃ ~ +85℃
- 封装：SOP-8
- 品牌：DOWO（东沃）
三、特点与优势
- 轨到轨输入/输出：在低压单电源系统中可最大化输入输出摆幅，减少外部偏置环路设计。
- 低功耗：每通道典型静态电流低至约几十微安，适合电池供电应用。
- 低输入噪声与良好 CMRR：适合精密信号放大与小信号采集。
- 宽压摆率与中等带宽：500 V/ms 的压摆率和约 1.1 MHz 的 GBP，能满足大多数低频到中频模拟前端需求。
- 小封装：SOP-8 便于通用 PCB 布线与批量生产。
四、典型应用场景
- 传感器信号调理（温度、压力、光电等低频传感器）
- 低速模数转换器（ADC）前置放大器与缓冲器
- 主动低通/高通滤波器、积分器与差分放大器
- 便携式与电池供电仪器（数据记录器、便携测量设备）
- 电平转换与驱动小负载（注意输出电流限制与热特性）
五、设计与使用建议
- 电源去耦：靠近器件的 Vdd/Vss 引脚放置 0.1 μF 与 1 μF 并联陶瓷电容，降低电源噪声与瞬态响应。
- 输入保护：尽管为轨到轨输入，但输入引脚避免长时间超过电源轨（尤其是超出最大电源宽度 7.5V），必要时加限流或钳位。
- 输出负载：输出可驱动至 30 mA，但在连续高电流输出时应关注温升与功耗。
- PCB 布线：模拟信号走线短且远离高频开关、数字干扰源，信号地与电源地合理分区并短接，以降低共模噪声。
- 温漂与偏置校准：若对直流精度有较高要求，建议在系统层面进行失调校准或选择配套补偿电路。
如需针对具体电路（如差分放大、仪表放大器或滤波器）的原理图和元件选型建议，可提供工作电压、增益与输入信号范围，我将给出更详细的设计参考。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
