Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DOWO PESD5V0S1BA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO PESD5V0S1BA
- Type
- DOWO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- PESD5V0S1BA
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.051g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 30pF
- Electronic Component
- BM0230654928
- Voltage
- 12V
- Electronic Component
- IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 500nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD5V0S1BA 产品概述
一、产品简介
PESD5V0S1BA（品牌：DOWO/东沃）为单路、双向瞬态抑制二极管，封装为SOD-323，专为5V类信号线和电源线的静电放电（ESD）与雷击浪涌（Surge）保护设计。器件响应快速、体积小、易于表面贴装，适合空间受限的移动终端、通信与工业控制设备。
二、主要技术参数
- 极性：双向
- 反向截止电压 Vrwm：5V
- 击穿电压 Vbr：6V（典型）
- 钳位电压 Vc：12V（测量条件见数据表）
- 峰值脉冲电流 Ipp：30A（8/20µs）
- 峰值脉冲功率 Ppp：250W @ 8/20µs（部分资料标注可达450W，最终以器件数据手册为准）
- 反向泄漏电流 Ir：500nA
- 结电容 Cj：30pF
- 通道数：单路（单通道双向）
- 防护等级：符合 IEC 61000-4-5（雷击浪涌）与 IEC 61000-4-2（静电放电）
- 封装：SOD-323（小型表贴）
三、关键特性与优势
- 双向结构可直接保护差分信号线或双向信号，无需额外反向元件。
- SOD-323 超小封装，利于高密度 PCB 布局与自动贴装生产。
- 低反向泄漏（500nA）可用于对泄漏敏感的接口和低功耗电路。
- 30A 的瞬态脉冲能力配合约12V的钳位，有效限制高能脉冲对后端器件的冲击。
- 30pF 的结电容在高速数据线上可接受，但对超高速差分链路需评估对信号完整性的影响。
四、典型应用场景
- USB、HDMI、UART、差分信号接口的ESD/Surge保护；
- 5V 供电总线与外围接口保护；
- 消费电子、移动终端、工业控制设备和通信设备的输入/输出端口。
五、使用与选型建议
- 在靠近外部连接器（如USB、I/O口）处尽量靠近焊盘放置，走线尽量短以降低寄生感抗和回路面积。
- 若保护高速差分信号，需评估30pF结电容对信号串扰和带宽的影响，必要时选择低电容型号。
- 对于更高能量的雷击/浪涌场景，请核实Ppp和Ipp的测试条件，并考虑并联或选型更高功率等级器件。
- 注意热量集中与PCB散热设计，避免长期在极限脉冲下工作。
六、可靠性与认证
该器件声明符合 IEC 61000-4-2 与 IEC 61000-4-5 标准的防护要求，适用于工业与消费级抗扰度设计。如需通过系统级认证（例如整机EMC测试），建议按标准做整机级别试验验证。
七、封装与采购
SOD-323 小封装利于贴片生产，建议向供应商确认包装形式（卷盘、切带）与批次一致性。因资料中对峰值功率存在差异，采购前务必索取并核对官方 Datasheet 与样品测试报告。
总结：PESD5V0S1BA 在小尺寸下提供较强的瞬态抑制能力，适合对5V接口进行经济高效的ESD/浪涌保护。选型时请结合具体应用的能量等级、信号带宽与PCB布线要求，确认最终器件数据以确保可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
