Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DOWO DW-1206-020-30
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DOWO DW-1206-020-30
- Type
- DOWO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DOWO
- Electronic Component
- DW-1206-020-30
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0264356194
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 30V
- Power(Pd)
- 600mW
- Current(Imax)
- 100A
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DW-1206-020-30 产品概述
一、产品简介
DW-1206-020-30 是 DOWO（东沃）推出的一款 1206 封装自恢复保险器（PPTC），针对电路过流和短路保护设计。标称工作电压为 30V，保持电流 0.2A（200mA），具有快速动作和自动复位特性，适用于消费电子、通信设备、电源模块及保护敏感电路的场景。
二、主要性能参数
- 耐压（Vmax）：30V
- 最大电流（Imax）：100A（冲击电流能力）
- 保持电流（Ihold）：200mA
- 跳闸电流（Itrip）：400mA
- 功率耗散（Pd）：600mW
- 初始态阻值（Rmin）：0.5Ω（500mΩ）
- 跳断后阻值（R1max）：2.6Ω
- 动作时间：100ms（典型，在达到 Itrip 条件下）
- 工作温度：-40℃～+85℃
- 封装：1206（适合 SMT 贴装）
三、工作原理与动作特性
该器件在正常工作时保持低阻抗（Rmin），允许电流在 Ihold 范围内稳定通过；当电流短时间超过 Itrip（约 400mA）时，器件在典型 100ms 内发生温度上升，进入高阻态，电阻可上升至 R1max（最大约 2.6Ω），从而限制故障电流并保护后级电路。故障清除并冷却后，器件可自动恢复至接近初始阻值，重新提供保护。Imax 指示器件能承受的瞬态冲击电流能力，适用于浪涌或短时过流事件。
四、主要优点
- 小尺寸（1206）易于在高密度 PCB 上布局；
- 自恢复特性免去更换熔断器的维护成本；
- 响应时间短（约 100ms），能在较短时间内限制过流损害；
- 支持较高的冲击电流（Imax 100A），对短路突发事件具有较好承受力；
- 宽工作温度范围，适应性强。
五、典型应用场景
- USB/数据线过流保护；
- 电源输入与分配线路保护；
- 通信设备与小功率电源模块；
- 便携设备与消费电子的板级保护。
六、安装建议与注意事项
- 采用标准 1206 SMT 焊盘布局，遵循厂家推荐的回流焊工艺，避免长时间高温暴露；
- 器件的 Ihold 和 Itrip 受环境温度影响，工作温度升高时有效电流会下降，布局时留有温度裕量；
- 对于长期靠近热源或高密度元件处，应考虑热隔离或移位安装，以保持保护特性稳定；
- 在设计中预留故障观察与测试点，便于现场诊断和验证。
七、储存与环境要求
- 推荐储存环境干燥、避免潮湿和强光直射；
- 工作与存储温度参考器件说明：-40℃～+85℃；
- 在高湿或腐蚀性气氛中使用需注意防护与封装可靠性。
总结：DW-1206-020-30 以其小巧封装、自恢复保护与较快动作特点，为中低电流电子设备提供可靠的过流防护方案。在实际设计中应结合实际工作温度、浪涌要求与 PCB 热布局进行合理选型与验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
