WMSIC Electronic Components

DOWO SP15100L

ModelSP15100L
PackageTO-277B
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO SP15100L
Type
DOWO
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
SP15100L
Electronic Component
1
Package
TO-277B
Electronic Component
Schottky Diode
Electronic Component
0.177g
Electronic Component
1
Electronic Component
BM0249905771
Current
15A
Diode
1
Current(Ir)
80uA@100V
(Vf)
740mV
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP15100L 产品概述 — 肖特基二极管(DOWO/东沃)

一、概述

SP15100L 是东沃(DOWO)推出的一款高电流、高耐压肖特基整流二极管,额定直流反向耐压为 100V,额定整流电流 15A,典型正向压降 Vf 为 740mV。该器件以低正向压降、快速恢复和较低的反向漏电流为主要特性,适用于需要高效率和高开关频率的电源与功率整流场景。非重复峰值浪涌电流 Ifsm 标称 200A(按行业惯例,如 JEDEC 8.3ms 半正弦波条件测量),器件工作结温范围为 -55℃ 至 +150℃。

二、主要电气参数(摘要)

  • 正向压降(Vf):约 740mV(典型值,测试条件请参考厂家数据手册)
  • 直流反向耐压(Vr):100V
  • 额定整流电流(If):15A
  • 反向电流(Ir):80μA @ 100V
  • 非重复峰值浪涌电流(Ifsm):200A(短时浪涌)
  • 工作结温范围:-55℃ ~ +150℃
  • 品牌:DOWO(东沃)
  • 封装:TO-277B(适合通孔安装与散热器固定)

三、封装与热管理

SP15100L 采用 TO-277B 封装,便于通孔安装并直接与散热器接触以降低结温。该二极管在大电流工作时正向压降导致显著功耗(例如在 15A 连续工作时理论 P ≈ Vf × If ≈ 0.74V × 15A ≈ 11.1W),因此必须采取良好散热措施:扩大散热面积、使用合适的散热器或导热垫、确保良好铜箔及通孔散热路径。长期高可靠运行应参考厂方的结温与电流额定曲线并做合理降额。

四、典型应用

  • 开关电源(整流与同步整流替代)
  • 逆变器与电机驱动的自由轮整流
  • LED 驱动电源与车用电源管理
  • 太阳能逆变器与储能设备的直流整流
  • 反向极性保护与高频整流场合

其低 Vf 和较低 Ir 特性使得在效率敏感和待机功耗要求高的系统中尤为适用。

五、设计与使用注意事项

  • 测量与验证:在目标工作电流和预计结温下实际测量 Vf 与热升,以确认散热方案是否满足要求。
  • 浪涌能力:Ifsm 为短时浪涌能力,设计中不可将其作为持续过载依据;应考虑启动浪涌和短路条件的保护电路(熔断器、限流、软启动等)。
  • 并联使用:若需提高平均电流,可并联多只二极管,但要注意正向压降差异导致的不均流,建议热耦合并配合均流措施。
  • PCB 布局:尽量缩短电流回路的走线,增大铜面积并采用多层过孔以降低寄生电阻和改善散热。
  • 焊接与装配:遵循厂商或行业焊接规范(如 IPC/JEDEC),避免过热或机械应力损伤封装与引脚。TO-277B 可通过螺栓/螺钉固定以增强散热联系。

六、可靠性与存储

器件的工作结温范围为 -55℃ 至 +150℃,存储与运输应避免潮湿、强酸碱及剧烈机械冲击。为保证长期性能,建议按标准电子元器件储存规范进行干燥保存并避免超出温湿度限制。关键应用(如汽车、电力设备)建议进行寿命试验与加速老化评估。

如需详细的电气特性曲线(Vf-If、Ir-Vr、结温-电流降额曲线)、包装细节或器件阻抗/热阻参数,请参考厂方 SP15100L 数据手册或联系东沃技术支持,以获得完整的工程验证资料。

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