WMSIC Electronic Components

DOWO 1N5822

Model1N5822
PackageDO-201AD
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO 1N5822
Type
DOWO
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
1N5822
Electronic Component
1
Package
DO-201AD
Electronic Component
Schottky Diode
Electronic Component
1.102g
Electronic Component
1
Electronic Component
BM0228586614
Current
3A
Diode
1
Current(Ir)
300uA@40V
(Vf)
550mV@10A
Electronic Component
65℃~+125℃
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5822(DOWO / 东沃)产品概述

一、概述与型号定位

1N5822 是一款常用的 Schottky 整流二极管,DOWO(东沃)提供的此型号面向中低压、大电流整流应用。该器件以低正向压降和快速开关特性为主,适合开关电源、降压转换器、续流和反向保护等场景。

二、主要电气参数

  • 工作结温范围:-65℃ ~ +125℃
  • 正向压降(Vf):0.55 V @ 10 A(典型值)
  • 额定整流电流:3 A(连续)
  • 非重复峰值浪涌电流(Ifsm):80 A(厂方给定的浪涌能力)
  • 直流反向耐压(Vr):40 V
  • 反向电流(Ir):300 μA @ 40 V(随温度上升会显著增加)
  • 封装:DO-201AD(轴向引线封装,利于手工或通孔安装)

三、结构与封装特点

DO-201AD 轴向封装提供良好的机械强度和焊接可靠性,便于通孔板和手工焊接。Schottky 结构决定了其正向压降明显低于普通硅整流二极管,同时反向恢复时间几乎为零,适合高频开关环境。但轴向封装对散热依赖 PCB 和散热片布局,需注意导线与焊盘的热阻设计。

四、性能优势与局限

优势:

  • 低正向压降,降低整流损耗,提高效率(尤其在低压大电流场合显著)。
  • 极短的恢复时间,开关损耗小,适合高频电源。
  • 良好的浪涌承受力,能够应对短时大电流冲击。

局限:

  • 最大反向电压仅 40 V,不适用于高压整流场合。
  • 反向漏电随温度上升快速增加,在高温环境下会影响静态功耗与系统稳定性。
  • 连续额定电流为 3 A,长时间大电流应用需做好热量管理或选更高额定的器件。

五、典型应用场景

  • 开关电源(DC-DC 降压整流)与次级整流。
  • 负载续流/自由轮二极管(例如电感性负载保护)。
  • 电池充电与电源反接保护(注意 Vr 与浪涌需求)。
  • 低压大电流整流链路,在效率敏感的场合替代普通硅整流器。

六、使用建议与注意事项

  • 散热管理:在连续 3 A 工作时,应保证足够的铜皮面积或加装散热器,轴向引线需尽量缩短热阻路径。
  • 温度影响:设计时考虑反向漏电随温度上升的增长,若工作环境偏高温需留余量或改用低漏型/更高 Vr 器件。
  • 浪涌保护:若存在频繁或更高幅值的浪涌,应评估 Ifsm 与实际脉冲条件(波形与持续时间),必要时并联或选择更高浪涌能力器件。
  • PCB 布局:整流回路应尽量短、粗,焊盘与走线加厚以降低导通损耗和局部升温。
  • 替换与选型:若需更高电压或更低漏电,可考虑高压 Schottky 或使用肖特基与肖特基管并联/热管理优化的方案。

结语:DOWO(东沃)封装为 DO-201AD 的 1N5822 以其低 Vf、快速响应和良好浪涌能力,被广泛用于中低压大电流整流场合。合理的热设计与对漏电随温度变化的预判,是确保长期可靠工作的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.