WMSIC Electronic Components

DOWO 500mA/24V 500MA

Model500mA/24V
Package1206
BrandDOWO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
DOWO 500m A / 24V
Type
DOWO
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
DOWO
Electronic Component
500mA/24V
Electronic Component
1
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.032g
Electronic Component
1
Electronic Component
8s
Electronic Component
BM0258715509
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
600mW
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DOWO(东沃)1206 自恢复熔断器 — 500mA / 24V 概述

一、产品简介

DOWO(东沃)1206 封装自恢复熔断器(PTC型),额定工作电压24V,保持电流(Ihold)0.5A,适用于24V电源系统的过流保护与短路防护。器件在过流时迅速升温增阻实现限流保护,故障解除后能自动恢复低阻态,免除更换操作,适合高可靠性和维护不便的应用场景。

二、主要电气参数

  • 最高工作电压(Vmax):24V
  • 最大可承受电流(Imax):40A(短时冲击)
  • 保持电流(Ihold):0.5A(不动作)
  • 跳闸电流(Itrip):1A(典型触发)
  • 功率消耗(Pd):600mW(稳态或特定测试条件)
  • 初始态阻值(Rmin):≈150mΩ
  • 跳断后阻值上限(R1max):700mΩ
  • 动作时间:约8秒(在规定过流条件下)
  • 工作温度:-40℃ 至 +85℃
  • 封装:1206(SMD,便于贴片安装)

三、典型特性与优势

  • 自恢复功能:过流后自动进入高阻限流,故障消除后恢复低阻态,减少维护成本。
  • 小型化:1206贴片封装占板面积小,适合空间受限的电路板设计。
  • 低导通阻抗:初始态约150mΩ,有利于降低压降和功耗。
  • 宽温范围:适用于汽车电子、工业控制等温度变化较大的环境。
  • 抗冲击能力:可承受短时高达40A的冲击电流,适合含启动电流的负载。

四、应用场景

  • 24V 汽车电子与轻型商用车电源保护
  • 电池包和电源管理模块的输出保护
  • 工业控制、PLC、电机驱动的辅助电源防护
  • LED 驱动、电源适配器与充电设备的短路保护
  • 通信设备与行车记录仪等对可维护性要求高的系统

五、选型与使用建议

  • 留有裕量:建议工作电流低于 Ihold,常用设计取 70%~80% 的裕量以避免重复动作。
  • 考虑环境温度:高温下 Ihold 会降低,应根据最高环境温度参照厂家热特性曲线做降额处理。
  • 布局注意:避免靠近持续热源安装,散热条件会影响动作时间与可靠性。
  • 与系统保护配合:在需要快速断开的大电流故障场合,可与熔断器或断路器并用,利用自恢复器件作为二级保护或限制启动电流。

六、可靠性与封装

1206 SMD 封装便于自动化贴装,满足表面贴装工艺要求。器件在多次动作恢复后阻值会有所上升(跳断后阻值最高可达700mΩ),属于正常现象,应在设计中考虑长期变化对电路影响。

七、采购与替代

品牌:DOWO(东沃)。选购时请确认完整型号与批次,并向供应商索要完整的电气特性曲线与热特性图以便准确设计。若需更高电流或更低电阻的保护方案,可考虑同类更大封装或并联使用,但并联需要匹配和热均衡设计。

总结:DOWO 1206 自恢复熔断器以其小尺寸、自动复位与良好的短时抗冲击能力,适合各种24V电子系统的过流防护。合理设计裕量与热环境,可获得长久可靠的保护效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.